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公开(公告)号：US20140217578A1
公开(公告)日：2014-08-07
申请号：US13833347
申请日：2013-03-15
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Lung-Hua Ho , Fei-Jain Wu , Chih-Ming Kuo , Shih-Chieh Chang , Chia-Jung Tu
IPC: H01L23/00
CPC classification number: H01L24/81 , H01L24/05 , H01L24/13 , H01L24/16 , H01L2224/0401 , H01L2224/13006 , H01L2224/13016 , H01L2224/13017 , H01L2224/13082 , H01L2224/13083 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/13562 , H01L2224/1601 , H01L2224/16503 , H01L2224/81048 , H01L2224/81193 , H01L2224/81203 , H01L2224/81898 , H01L2924/1461 , H01L2924/00 , H01L2924/00014 , H01L2924/01047 , H01L2924/00012
Abstract: A semiconductor package process includes the following steps, providing a first substrate having a first metal bump, the first metal bump comprises a joint portion having a first softening point; providing a second substrate having a second metal bump having a top surface, a lateral surface and a second softening point, wherein the first softening point is smaller than the second softening point; performing a heating procedure to make the joint portion of the first metal bump become a softened state; and laminating the first substrate on the second substrate to make the second metal bump embedded into the joint portion in the softened state to make the top surface and the lateral surface of the at least one second metal bump being clad extendedly by compressing the joint portion in the softened state.
Abstract translation: 半导体封装工艺包括以下步骤：提供具有第一金属凸块的第一衬底，第一金属凸块包括具有第一软化点的接合部分; 提供具有第二金属凸块的第二基板，其具有顶表面，侧表面和第二软化点，其中所述第一软化点小于所述第二软化点; 执行加热程序以使第一金属凸块的接合部分变为软化状态; 并且将所述第一基板层压在所述第二基板上，以使所述第二金属凸块以软化状态嵌入所述接合部，以使所述至少一个第二金属凸块的顶表面和所述侧表面通过压缩所述接合部分 软化状态。
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公开(公告)号：US20180090379A1
公开(公告)日：2018-03-29
申请号：US15342241
申请日：2016-11-03
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chia-Jung Tu , Chih-Lung Chen , Wen-Hsiang Liao , Chung-Hsiang Wei , Yung-Chi Liu
IPC: H01L21/78 , H01L23/544 , H01L21/304
CPC classification number: H01L21/78 , H01L21/6835 , H01L2221/68327
Abstract: A wafer dicing method comprises providing a wafer and performing a cutting procedure and a contacting procedure. The wafer includes a plurality of dies and a metal layer, wherein the metal layer is formed on a scribe line which is formed between adjacent dies. A cutter is used to cut the metal layer along the scribe line during the cutting procedure to form a plurality of dies on the wafer, and the metal layer cut by the cutter remains a plurality of metal burrs on the dies. A brush is used to contact with the metal burrs along the cutting slot during the contracting procedure to prevent each of the metal burrs from protruding from a surface of each of the dies.
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公开(公告)号：US09929051B1
公开(公告)日：2018-03-27
申请号：US15342241
申请日：2016-11-03
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chia-Jung Tu , Chih-Lung Chen , Wen-Hsiang Liao , Chung-Hsiang Wei , Yung-Chi Liu
IPC: H01L21/00 , H01L21/78 , H01L21/30 , H01L23/544 , H01L21/304
CPC classification number: H01L21/78 , H01L21/6835 , H01L2221/68327
Abstract: A wafer dicing method comprises providing a wafer and performing a cutting procedure and a contacting procedure. The wafer includes a plurality of dies and a metal layer, wherein the metal layer is formed on a scribe line which is formed between adjacent dies. A cutter is used to cut the metal layer along the scribe line during the cutting procedure to form a plurality of dies on the wafer, and the metal layer cut by the cutter remains a plurality of metal burrs on the dies. A brush is used to contact with the metal burrs along the cutting slot during the contracting procedure to prevent each of the metal burrs from protruding from a surface of each of the dies.
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公开(公告)号：US09510441B2
公开(公告)日：2016-11-29
申请号：US14642945
申请日：2015-03-10
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chin-Tang Hsieh , Fei-Jain Wu , Chia-Jung Tu
CPC classification number: H05K1/0209 , H05K1/0203 , H05K1/028 , H05K1/0346 , H05K1/0393 , H05K1/189 , H05K2201/0154 , H05K2201/066 , H05K2201/068
Abstract: A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.
Abstract translation: 柔性基板包括电路板，柔性散热结构和粘合剂。 电路基板具有形成在基板顶面的基板和电路层，柔性散热结构具有柔性支撑板和形成在柔性支撑板的表面上的柔性散热金属层。 柔性散热结构的柔性散热金属层通过粘合剂与基板的底面连接。 电路层和柔性散热金属层由相同的材料制成。
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公开(公告)号：US09159660B2
公开(公告)日：2015-10-13
申请号：US14042979
申请日：2013-10-01
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chin-Tang Hsieh , Chih-Ming Kuo , Chia-Jung Tu , Shih-Chieh Chang , Chih-Hsien Ni , Lung-Hua Ho , Chaun-Yu Wu , Kung-An Lin
IPC: H01L23/498 , H01L23/31 , H01L21/56 , H01L23/00 , H01L25/065 , H01L21/48
CPC classification number: H01L23/49811 , H01L21/4846 , H01L21/563 , H01L23/3128 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/1147 , H01L2224/11472 , H01L2224/11831 , H01L2224/11903 , H01L2224/11906 , H01L2224/13011 , H01L2224/13017 , H01L2224/13019 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16058 , H01L2224/8114 , H01L2224/81193 , H01L2224/81345 , H01L2225/06513 , H01L2225/06565 , H01L2924/00014 , H01L2924/014
Abstract: A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.
Abstract translation: 半导体封装结构包括第一衬底，第二衬底和密封剂。 第一基板包括多个第一凸块和多个第一焊料层。 每个第一焊料层形成在每个第一凸块上，并且包括具有内表面的锥形槽。 第二基板包括多个第二凸块和多个第二焊料层。 每个第二焊料层形成在每个第二凸块上并且包括外表面。 每个第二焊料层是锥形体。 第二焊料层耦合到第一焊料层并且容纳在第一焊料层内。 锥形槽的内表面与第二焊料层的外表面接触。 密封剂形成在第一基板和第二基板之间。
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Patent Agency Ranking
公开(公告)号：US20140027905A1
公开(公告)日：2014-01-30
申请号：US14042979
申请日：2013-10-01
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chin-Tang Hsieh , Chih-Ming Kuo , Chia-Jung Tu , Shih-Chieh Chang , Chih-Hsien Ni , Lung-Hua Ho , Chaun-Yu Wu , Kung-An Lin
IPC: H01L23/498
CPC classification number: H01L23/49811 , H01L21/4846 , H01L21/563 , H01L23/3128 , H01L23/49816 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L25/0657 , H01L2224/1147 , H01L2224/11472 , H01L2224/11831 , H01L2224/11903 , H01L2224/11906 , H01L2224/13011 , H01L2224/13017 , H01L2224/13019 , H01L2224/13082 , H01L2224/13083 , H01L2224/13084 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/13155 , H01L2224/16058 , H01L2224/8114 , H01L2224/81193 , H01L2224/81345 , H01L2225/06513 , H01L2225/06565 , H01L2924/00014 , H01L2924/014
Abstract: A semiconductor package structure includes a first substrate, a second substrate and an encapsulant. The first substrate comprises a plurality of first bumps and a plurality of first solder layers. Each of the first solder layers is formed on each of the first bumps and comprises a cone-shaped slot having an inner surface. The second substrate comprises a plurality of second bumps and a plurality of second solder layers. Each of the second solder layers is formed on each of the second bumps and comprises an outer surface. Each of the second solder layers is a cone-shaped body. The second solder layer couples to the first solder layer and is accommodated within the first solder layer. The inner surface of the cone-shaped slot contacts with the outer surface of the second solder layer. The encapsulant is formed between the first substrate and the second substrate.
Abstract translation: 半导体封装结构包括第一衬底，第二衬底和密封剂。 第一基板包括多个第一凸块和多个第一焊料层。 每个第一焊料层形成在每个第一凸块上，并且包括具有内表面的锥形槽。 第二基板包括多个第二凸块和多个第二焊料层。 每个第二焊料层形成在每个第二凸块上并且包括外表面。 每个第二焊料层是锥形体。 第二焊料层耦合到第一焊料层并且容纳在第一焊料层内。 锥形槽的内表面与第二焊料层的外表面接触。 密封剂形成在第一基板和第二基板之间。
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公开(公告)号：US20210035947A1
公开(公告)日：2021-02-04
申请号：US17072175
申请日：2020-10-16
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chin-Tang Hsieh , Chia-Jung Tu
IPC: H01L23/00
Abstract: Method and device for compression bonding are disclosed. During compression bonding a chip to a substrate, an anti-adhesion layer on a stage is provided to contact with a solder resist layer on the substrate. The solder resist layer will not stick to the anti-adhesion layer such that the reduction of bonding precision due to the solder resist layer remains residues on the compression bonding device is preventable.
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公开(公告)号：US09961759B2
公开(公告)日：2018-05-01
申请号：US15279657
申请日：2016-09-29
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chin-Tang Hsieh , Fei-Jain Wu , Chia-Jung Tu
CPC classification number: H05K1/0209 , H05K1/0203 , H05K1/028 , H05K1/0346 , H05K1/0393 , H05K1/189 , H05K2201/0154 , H05K2201/066 , H05K2201/068
Abstract: A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.
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公开(公告)号：US20170019984A1
公开(公告)日：2017-01-19
申请号：US15279657
申请日：2016-09-29
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chin-Tang Hsieh , Fei-Jain Wu , Chia-Jung Tu
CPC classification number: H05K1/0209 , H05K1/0203 , H05K1/028 , H05K1/0346 , H05K1/0393 , H05K1/189 , H05K2201/0154 , H05K2201/066 , H05K2201/068
Abstract: A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.
Abstract translation: 柔性基板包括电路板，柔性散热结构和粘合剂。 电路基板具有形成在基板顶面的基板和电路层，柔性散热结构具有柔性支撑板和形成在柔性支撑板的表面上的柔性散热金属层。 柔性散热结构的柔性散热金属层通过粘合剂与基板的底面连接。 电路层和柔性散热金属层由相同的材料制成。
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公开(公告)号：US20160234927A1
公开(公告)日：2016-08-11
申请号：US14642945
申请日：2015-03-10
Applicant: CHIPBOND TECHNOLOGY CORPORATION
Inventor： Chin-Tang Hsieh , Fei-Jain Wu , Chia-Jung Tu
CPC classification number: H05K1/0209 , H05K1/0203 , H05K1/028 , H05K1/0346 , H05K1/0393 , H05K1/189 , H05K2201/0154 , H05K2201/066 , H05K2201/068
Abstract: A flexible substrate includes a circuit board, a flexible heat-dissipating structure and an adhesive. The circuit board has a substrate and a circuit layer formed on a top surface of the substrate, and the flexible heat-dissipating structure has a flexible supporting plate and a flexible heat-dissipating metal layer formed on a surface of the flexible supporting plate. The flexible heat-dissipating metal layer of the flexible heat-dissipating structure is connected with a bottom surface of the substrate by the adhesive. The circuit layer and the flexible heat-dissipating metal layer are made of same material.
Abstract translation: 柔性基板包括电路板，柔性散热结构和粘合剂。 电路基板具有形成在基板顶面的基板和电路层，柔性散热结构具有柔性支撑板和形成在柔性支撑板的表面上的柔性散热金属层。 柔性散热结构的柔性散热金属层通过粘合剂与基板的底面连接。 电路层和柔性散热金属层由相同的材料制成。
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