Abstract:
A tunable electromicromechanical resonator structure incorporates an electrostatic actuator which permits reduction or enhancement of the resonant frequency of the structure. The actuator consists of two sets of opposed electrode fingers, each set having a multiplicity of spaced, parallel fingers. One set is mounted on a movable portion of the resonator structure and one set is mounted on an adjacent fixed base on substrate, with the fingers in opposed relationship and their adjacent ends spaced apart by a gap. An adjustable bias voltage across the sets of electrodes adjusts the resonant frequency of the movable structure.
Abstract:
A tunable electromechanical resonator structure incorporates an electrostatic actuator (66, 68) which permits reduction or enhancement of the resonant frequency of the structure. The actuator consists of two sets of opposed electrode fingers, each set having a multiplicity of spaced, parallel fingers (70, 72, 84, 90). One set (70, 72) is mounted on a movable portion (54) of the resonator structure and one set (84, 90) is mounted on an adjacent fixed base (132, 134) on the substrate, adjacent ends spaced apart by a gap (86, 92). An adjustable bias voltage (130) across the sets of electrodes adjusts the resonant frequency of the movable structure.
Abstract:
A tunable electromicromechanical resonator structure incorporates an electrostatic actuator which permits reduction or enhancement of the resonant frequency of the structure. The actuator consists of two sets of opposed electrode fingers, each set having a multiplicity of spaced, parallel fingers. One set is mounted on a movable portion of the resonator structure and one set is mounted on an adjacent fixed base on substrate, with the fingers in opposed relationship and their adjacent ends spaced apart by a gap. An adjustable bias voltage across the sets of electrodes adjusts the resonant frequency of the movable structure.
Abstract:
SE TRATA DE UNA ESTRUCTURA DE RESONADOR ELECTROMECANICO QUE SE PUEDE AFINAR Y QUE INCORPORA UN IMPULSOR ELECTROSTATICO (66, 68) QUE PERMITE LA ATENUACION O LA ELEVACION DE LA FRECUENCIA DE RESONANCIA DE LA ESTRUCTURA. EL IMPULSOR CONSISTE EN DOS CONJUNTOS DE ELECTRODOS OPUESTOS, EN FORMA DE DEDOS, CADA UNO DE CUYOS CONJUNTOS TIENE VARIOS DEDOS SEPARADOS Y PARALELOS ENTRE SI (70, 72, 84, 90). UN CONJUNTO (70, 72) ESTA MONTADO SOBRE UNA PARTE MOVIL (54) DE LA ESTRUCTURA DEL RESONADOR Y EL OTRO CONJUNTO (84, 90) ESTA MONTADO SOBRE UNA BASE FIJA ADYACENTE (132, 134) SITUADA SOBRE EL SUSTRATO; LOS EXTREMOS ADYACENTES ESTAN SEPARADOS POR UN ESPACIO VACIO (86, 92). UNA TENSION DE POLARIZACION GRADUABLE (130) PASANDO POR LOS DOS CONJUNTOS DE ELECTRODOS AFINA LA FRECUENCIA DE RESONANCIA DE LA ESTRUCTURA MOVIL.
Abstract:
A tunable electromechanical resonator structure incorporates an electrostatic actuator (66, 68) which permits reduction or enhancement of the resonant frequency of the structure. The actuator consists of two sets of opposed electrode fingers, each set having a multiplicity of spaced, parallel fingers (70, 72, 84, 90). One set (70, 72) is mounted on a movable portion (54) of the resonator structure and one set (84, 90) is mounted on an adjacent fixed base (132, 134) on the substrate, adjacent ends spaced apart by a gap (86, 92). An adjustable bias voltage (130) across the sets of electrodes adjusts the resonant frequency of the movable structure.
Abstract:
An isolation process which enhances the performance of silicon micromechanical devices incorporates dielectric isolation segments (254, 256) within the silicon microstructure, which is otherwise composed of an interconnected grid of cantilevered beams. A metal layer on top of the beams (276, 278) provides interconnects (244, 246) and also allows contact to the silicon beams. Multiple conduction paths are incorporated through a metal patterning step prior to structure definition. The invention improves manufacturability of previous processes by performing all lithographic patterning steps on flat topographies, and removing complicated metal sputtering steps required of most high aspect ratio processes. With little modification, the invention can be implemented with integrated circuit fabrication sequences for fully integrated devices.
Abstract:
A microelectromechanical accelerometer (60) having submicron features is fabricated from a single crystal silicon substrate (10). The accelerometer includes a movable portion incorporating an axial beam (102) carrying laterally-extending high aspect ratio released fingers (110-117, 120-127) cantilevered above the floor of a cavity formed in the substrate during the fabrication process. The movable portion is supported by restoring springs (132, 142) having controllable flexibility to vary the resonant frequency of the structure. A multiple-beam structure provides stiffness in the movable portion for accuracy.
Abstract:
An isolation process which enhances the performance of silicon micromechanical devices incorporates dielectric isolation segments (254, 256) within the silicon microstructure, which is otherwise composed of an interconnected grid of cantilevered beams. A metal layer on top of the beams (276, 278) provides interconnects (244, 246) and also allows contact to the silicon beams. Multiple conduction paths are incorporated through a metal patterning step prior to structure definition. The invention improves manufacturability of previous processes by performing all lithographic patterning steps on flat topographies, and removing complicated metal sputtering steps required of most high aspect ratio processes. With little modification, the invention can be implemented with integrated circuit fabrication sequences for fully integrated devices.