SUBSTRATES FOR POWDER DEPOSITION CONTAINING CONDUCTIVE DOMAINS

    公开(公告)号:CA2413549A1

    公开(公告)日:2002-01-17

    申请号:CA2413549

    申请日:2001-07-11

    Abstract: Provided is, among other things, a conductive inlay film comprising; a layer of dielectric film (21) having a pattern of holes (23) suitable to define selected regions to which particles will be deposited by electrostatic deposition; and a conductive element (22) comprising polymer, which element comprises (a) a conductive film laminated (22) against the dielectric film (21) or (b) a conductive film embedded within the holes (23), the portion of the conductive element appearing within the holes comprising conductive inlays, wherein the conductive element (22) is adapted to contact one or mor e electrode pads and provide electrical potential at the selected regions, and wherein the dielectric film (21) electrically isolates the selected regions.

    SUBSTRATES FOR POWDER DEPOSITION CONTAINING CONDUCTIVE DOMAINS

    公开(公告)号:HU0301611A2

    公开(公告)日:2003-08-28

    申请号:HU0301611

    申请日:2001-07-11

    Abstract: Provided is, among other things, a conductive inlay film comprising; a layer of dielectric film (21) having a pattern of holes (23) suitable to define selected regions to which particles will be deposited by electrostatic deposition; and a conductive element (22) comprising polymer, which element comprises (a) a conductive film laminated (22) against the dielectric film (21) or (b) a conductive film embedded within the holes (23), the portion of the conductive element appearing within the holes comprising conductive inlays, wherein the conductive element (22) is adapted to contact one or more electrode pads and provide electrical potential at the selected regions, and wherein the dielectric film (21) electrically isolates the selected regions.

    Improved solid pharmaceutical dosage formulation of hydrophobic drugs

    公开(公告)号:AU8477201A

    公开(公告)日:2002-02-25

    申请号:AU8477201

    申请日:2001-08-09

    Abstract: A novel solid pharmaceutical dosage formulation of hydrophobic drugs is disclosed, which provides enhanced dissolution and improved bioavailability. The formulation comprises: a base substrate comprising a first polymer; a deposit, comprising a therapeutic amount of a hydrophobic drug, deposited on the base substrate; a cover substrate comprising a second polymer, the cover substrate covering the deposit and joined to the base substrate by a bond that encircles the deposit; and a dissolution-enhancing amount of a surfactant, disposed within a carrier that is segregated from, but in contact with, the deposit. In another embodiment, the dosage form may include any pharmaceutically acceptable additive, disposed within a carrier that is segregated from, but in contact with, the deposit. In a preferred embodiment, the hydrophobic drug is deposited electrostatically on the base substrate.

    Substrates for powder deposition containing conductive domains

    公开(公告)号:AU7726801A

    公开(公告)日:2002-01-21

    申请号:AU7726801

    申请日:2001-07-11

    Abstract: Provided is, among other things, a conductive inlay film comprising; a layer of dielectric film (21) having a pattern of holes (23) suitable to define selected regions to which particles will be deposited by electrostatic deposition; and a conductive element (22) comprising polymer, which element comprises (a) a conductive film laminated (22) against the dielectric film (21) or (b) a conductive film embedded within the holes (23), the portion of the conductive element appearing within the holes comprising conductive inlays, wherein the conductive element (22) is adapted to contact one or more electrode pads and provide electrical potential at the selected regions, and wherein the dielectric film (21) electrically isolates the selected regions.

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