公开(公告)号：EP2079085A2

公开(公告)日：2009-07-15

申请号：EP08172026.0

申请日：2008-12-17

Applicant: Delphi Technologies, Inc.

Inventor： Berlin, Carl W. ,  Zimmerman, David W. ,  Djordjevic, Aleksandra

IPC: H01F17/00 ,  H01F27/34

CPC classification number: H01F17/0013 ,  H01F27/346

Abstract: An inductor (30,130) and method (100) of containing a magnetic field is provided. The inductor (30,130) includes a first set of layers (32,132) wound in a first predetermined direction, wherein each layer of the first set of layers (32,132) is electrically connected to one another, and a second set of layers (34,134) wound in a second predetermined direction, wherein each layer of the second set of layers (34,134) is electrically connected to one another and the first set of layers (32,132), and the second set of layers (34,134) is between a top layer (32A,132A) and a bottom layer (32B,132B), such that the top layer (32A,132A) forms a first pair with a first layer of the second set of layers (34,134), and the bottom layer (32B,132B) forms a second pair with a second layer of the second set of layers (34,134) so that the magnetic field is substantially contained, such as to remain substantially within a gap (35,135) defined between each layer of the pairs of layers.

Abstract translation: 提供了一种包含磁场的电感器（30,130）和方法（100）。 电感器（30,130）包括沿第一预定方向缠绕的第一组层（32,132），其中第一组层（32,132）的每个层彼此电连接，并且第二组层（34,134）缠绕 在第二预定方向上，其中第二组层（34,134）的每个层彼此电连接，并且第一组层（32,132）和第二组层（34,134）位于顶层（32A）之间 ，132A）和底层（32B，132B），使得顶层（32A，132A）与第二组层（34,134）的第一层和底层（32B，132B）形成第一对， 与第二组层（34,134）的第二层形成第二对，使得基本上包含磁场，例如基本上保持在每层层之间限定的间隙（35,135）内。

公开(公告)号：EP2043150A2

公开(公告)日：2009-04-01

申请号：EP08164601.0

申请日：2008-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Walsh, Matthew R. ,  Nair, Deepukumar M. ,  Zimmerman, David W. ,  Haffke, Benjamen E. ,  Brandenburg, Scott D.

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2924/1617 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01P5/107

Abstract: A microwave communication package (10) is constructed on an electrically conducting base plate (12) having a first side (14) defining a base plate cavity (16), with an antenna apparatus (40) mounted on an opposite, second side (18). A dielectric substrate (20) on the first side of the base plate covers the base plate cavity; and sealing apparatus (72) contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry (30, 32) mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines (54) communicating components (30) to one or more waveguides comprising openings (50) extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.

Abstract translation: 微波通信封装（10）构造在具有限定基板腔（16）的第一侧面（14）的导电基板（12）上，天线装置（40）安装在相对的第二侧（18 ）。 基板的第一侧上的电介质基板（20）覆盖基板空腔; 并且密封装置（72）使绝缘基片和基板完全围绕底板腔体密封，密封空腔。 安装在基板腔内的基板表面上的电路（30,32）包括一个或多个微带线路（54），其将部件（30）连接到一个或多个包括延伸穿过基板的开口（50）的波导; 并且波导在其相对端耦合到天线装置。

公开(公告)号：EP1667226A2

公开(公告)日：2006-06-07

申请号：EP05077632.7

申请日：2005-11-18

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Zimmerman, David W. ,  Chengalva, Suresh K.

IPC: H01L23/36 ,  H05K7/20

CPC classification number: H05K1/021 ,  H01L23/13 ,  H01L23/36 ,  H01L23/367 ,  H01L23/3675 ,  H01L23/5389 ,  H01L24/48 ,  H01L25/16 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/4847 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01087 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19107 ,  H05K1/0306 ,  H05K1/183 ,  H05K3/0061 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2201/09745 ,  H05K2201/1056 ,  H01L2924/00 ,  H01L2224/0401 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: A circuit board assembly (40,50) having a laminate construction of multiple layers (12), such as a LTCC ceramic substrate (10), with conductor lines (30) between adjacent pairs of layers (12). A heat sink (22) is bonded to a first surface (26) of the substrate (10), and a cavity (24) is defined by and between the heat sink (22) and the substrate (10) such that a base wall (28) of the cavity (24) is defined by one of the layers (12) with conductor lines (30) thereof being present on the base wall (28). A surface-mount circuit device (14) is received within the cavity (24), mounted to the base wall (28), and electrically connected to the conductor lines (30) on the base wall (28). The device (14) is received within the cavity (24) such that a surface of the device (14) contacts a surface region of the heat sink (22). The surface of the device (14) is bonded to the surface region of the heat sink (22) to provide a substantially direct thermal path from the device (14) to the heat sink (22).

Abstract translation: 电路板组件（40,50）具有多层（12）的叠层结构，例如LTCC陶瓷衬底（10），在相邻的层对（12）之间具有导线（30）。 散热器（22）被结合到基板（10）的第一表面（26）上，并且在散热器（22）和基板（10）之间由散热器（22）和基板（10）之间限定空腔（24），使得底壁 腔（24）中的一个（28）由其中一个层（12）限定，其中导体线（30）存在于基壁（28）上。 表面安装电路装置（14）被容纳在空腔（24）内，安装到基壁（28），并且电连接到基壁（28）上的导线（30）。 装置（14）被容纳在空腔（24）内，使得装置（14）的表面接触散热器（22）的表面区域。 装置（14）的表面结合到散热器（22）的表面区域，以提供从装置（14）到散热器（22）的基本上直接的热路径。

公开(公告)号：EP1523036A2

公开(公告)日：2005-04-13

申请号：EP04077669.2

申请日：2004-09-28

Applicant: Delphi Technologies, Inc.

Inventor： Mandel, Larry M. ,  Sarma, Dwadasi H. ,  Gertiser, Kevin M. ,  Zimmerman, David W. ,  Chengalva, Suresh K.

IPC: H01L23/367 ,  H01L25/065

CPC classification number: H01L23/42 ,  H01L25/0655 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (18) and a semiconductor device (12) mounted to the substrate (18). The semiconductor device (12) has electrical circuitry a first surface, and a second surface oppositely disposed from the first surface. A thermally conductive heat sink (30) is assembled over the semiconductor device (12) such that a cavity (32) is formed between the semiconductor device (12) and the heat sink (30). A thermally conductive and electrically insulative material (36) is disposed in the cavity (32) between the semiconductor device (12) and the heat sink (30).

Abstract translation: 提供具有增强的散热的电子封装（10），其在相反的方向上呈现出双重传导热路（40,42）。 封装（10）包括衬底（18）和安装到衬底（18）的半导体器件（12）。 半导体器件（12）具有电路，第一表面和与第一表面相对设置的第二表面。 导热散热器（30）组装在半导体器件（12）上，使得在半导体器件（12）和散热器（30）之间形成空腔（32）。 导热和电绝缘材料（36）设置在半导体器件（12）和散热器（30）之间的空腔（32）中。

公开(公告)号：EP2595187A2

公开(公告)日：2013-05-22

申请号：EP12191255.4

申请日：2012-11-05

Applicant: Delphi Technologies, Inc.

Inventor： Purden, George J. ,  Zimmerman, David W.

IPC: H01L23/66

CPC classification number: H01L23/66 ,  H01L23/13 ,  H01L23/49822 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2224/48091 ,  H01P3/121 ,  H01P5/107 ,  H01L2924/00014

Abstract: A surface mountable transition block (10) for perpendicular transitions between a microstrip (16) or stripline and a waveguide (20). The transition block (10) configuration allows for a reduction in the overall cost of a microwave circuit assembly (12) because the circuit board (14) to which the transition block (10) is attached can be an FR-4 type circuit board (14) as opposed to more expensive microwave circuit board (14) materials.

公开(公告)号：EP2407348A1

公开(公告)日：2012-01-18

申请号：EP11172691.5

申请日：2011-07-05

Applicant: Delphi Technologies, Inc.

Inventor： Fairchild, M. Ray ,  Zimmerman, David W. ,  Miller, Michael E.

IPC: B60R1/00 ,  G06K9/00

CPC classification number: B60R1/00 ,  B60R2300/202 ,  B60R2300/301 ,  B60R2300/306 ,  B60R2300/70 ,  B60R2300/802 ,  B60R2300/8093 ,  G06K9/00805 ,  G06K9/2054

Abstract: A vision system in a vehicle (10) and a method (600) for operating the system. The system displays a field of view that is a portion of an image (200) of an area (24) proximate to the vehicle (10). The system includes an object detection means that provides an indication of an object being present in the area (24) proximate to the vehicle (10). The field of view is selected at least in part based on the detection of the object, such as directing the field of view toward the object so the vehicle (10) driver (12) can more easily discern the presence of the object in a display (14).

Abstract translation: 视觉系统在车辆（10）和用于操作该系统的方法（600），该系统显示的视场确实是一个区域的图像（200）的一个部分（24）靠近所述车辆（10） ， 该系统包括在物体检测bedeutet，DASS提供有关对象存在于该区域的指示（24）靠近所述车辆（10）。 的视场至少部分地基于所述检测的对象，颜色的选择：如引导的视场朝向物体为车辆（10）驾驶员（12）可以更容易地辨别在显示的物体的存在 （14）。

公开(公告)号：EP1523040B1

公开(公告)日：2018-08-29

申请号：EP04077702.1

申请日：2004-09-30

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Mandel, Larry M. ,  Sarma, Dwadasi H. ,  Gertiser, Kevin M. ,  Zimmerman, David W.

IPC: H01L25/065 ,  H01L23/367 ,  H01L23/427 ,  H01L23/42 ,  H01L21/48 ,  H01L21/56

CPC classification number: H01L23/427 ,  H01L21/4878 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  Y10T29/49144

Abstract: An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (16) having electrical conductors thereon and a flip chip (12) mounted to the substrate (16). The flip chip (12) has a first surface, solder bumps (14) on the first surface, and a second surface oppositely disposed from the first surface. The flip chip (12) is mounted to the substrate (16) such that the solder bumps (14) are registered with the conductors on the substrate (16). The package (10) further includes a stamped metal heat sink (30) in heat transfer relationship with the second surface of the flip chip (12). The heat sink (30) includes a cavity (32) formed adjacent to the flip chip (12) containing a thermally conductive material (34).

公开(公告)号：EP2043150B1

公开(公告)日：2016-07-20

申请号：EP08164601.0

申请日：2008-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Walsh, Matthew R. ,  Nair, Deepukumar M. ,  Zimmerman, David W. ,  Haffke, Benjamen E. ,  Brandenburg, Scott D.

IPC: H01L23/66 ,  H01Q23/00 ,  H01P5/107

CPC classification number: H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2924/1617 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01P5/107

公开(公告)号：EP2043150A3

公开(公告)日：2011-11-02

申请号：EP08164601.0

申请日：2008-09-18

Applicant: Delphi Technologies, Inc.

Inventor： Walsh, Matthew R. ,  Nair, Deepukumar M. ,  Zimmerman, David W. ,  Haffke, Benjamen E. ,  Brandenburg, Scott D.

IPC: H01L23/66 ,  H01Q23/00 ,  H01P5/107

CPC classification number: H01L23/66 ,  H01L2223/6627 ,  H01L2223/6633 ,  H01L2223/6677 ,  H01L2924/1617 ,  H01L2924/19032 ,  H01L2924/19039 ,  H01P5/107

Abstract: A microwave communication package (10) is constructed on an electrically conducting base plate (12) having a first side (14) defining a base plate cavity (16), with an antenna apparatus (40) mounted on an opposite, second side (18). A dielectric substrate (20) on the first side of the base plate covers the base plate cavity; and sealing apparatus (72) contacting the dielectric substrate and the base plate completely around the base plate cavity hermetically seals the cavity. Circuitry (30, 32) mounted on a surface of the substrate within the base plate cavity includes one or more microstrip lines (54) communicating components (30) to one or more waveguides comprising openings (50) extending through the base plate; and the waveguides are coupled at their opposite ends to the antenna apparatus.

公开(公告)号：EP1523040A2

公开(公告)日：2005-04-13

申请号：EP04077702.1

申请日：2004-09-30

Applicant: Delphi Technologies, Inc.

Inventor： Chengalva, Suresh K. ,  Mandel, Larry M. ,  Sarma, Dwadasi H. ,  Gertiser, Kevin M. ,  Zimmerman, David W.

IPC: H01L25/065 ,  H01L23/367

CPC classification number: H01L23/427 ,  H01L21/4878 ,  H01L21/4882 ,  H01L21/563 ,  H01L23/3675 ,  H01L23/3677 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/73204 ,  H01L2224/73253 ,  Y10T29/49144

Abstract: An electronic package (10) having enhanced heat dissipation is provided exhibiting dual conductive heat paths (40, 42) in opposing directions. The package (10) includes a substrate (16) having electrical conductors thereon and a flip chip (12) mounted to the substrate (16). The flip chip (12) has a first surface, solder bumps (14) on the first surface, and a second surface oppositely disposed from the first surface. The flip chip (12) is mounted to the substrate (16) such that the solder bumps (14) are registered with the conductors on the substrate (16). The package (10) further includes a stamped metal heat sink (30) in heat transfer relationship with the second surface of the flip chip (12). The heat sink (30) includes a cavity (32) formed adjacent to the flip chip (12) containing a thermally conductive material (34).

Abstract translation: 提供具有增强的散热的电子封装（10），其在相反的方向上呈现出双重传导热路（40,42）。 封装（10）包括其上具有电导体的衬底（16）和安装到衬底（16）的倒装芯片（12）。 倒装芯片（12）具有第一表面，第一表面上的焊料凸块（14）和与第一表面相对设置的第二表面。 倒装芯片（12）安装到基板（16），使得焊料凸块（14）与基板（16）上的导体对准。 封装（10）还包括与倒装芯片（12）的第二表面传热关系的冲压金属散热器（30）。 散热器（30）包括与包含导热材料（34）的倒装芯片（12）相邻形成的空腔（32）。