公开(公告)号：EP1628509A3

公开(公告)日：2006-10-04

申请号：EP05076727.6

申请日：2005-07-27

Applicant: Delphi Technologies, Inc.

Inventor： Delheimer, Charles I. ,  Workman, Derek B. ,  Tsai, Jeenhuei S. ,  Walsh, Matthew R. ,  Brandenburg, Scott D. ,  Thompson, Brian D.

IPC: H05K3/28 ,  H05K3/30 ,  H01L23/31 ,  H01L21/56

CPC classification number: H05K3/303 ,  H01L21/563 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic module (100) includes a substrate (108), at least one surface mounted integrated circuit (IC) component (110) and an underfill material (122). The substrate (108) includes a plurality of electrically conductive traces (118A,118B), formed on at least one surface of the substrate (108), and the component (110) is electrically coupled to at least one of the conductive traces (118A,118B). The underfill material (122) is positioned between the component (110) and the substrate (108) and provides at least one pedestal that supports the component (110) during encapsulation. The underfill material (122), when cured, maintains the integrity of the electrical connections between the component (110) and the conductive traces (118A,118B).

公开(公告)号：EP1628509A2

公开(公告)日：2006-02-22

申请号：EP05076727.6

申请日：2005-07-27

Applicant: Delphi Technologies, Inc.

Inventor： Delheimer, Charles I. ,  Workman, Derek B. ,  Tsai, Jeenhuei S. ,  Walsh, Matthew R. ,  Brandenburg, Scott D. ,  Thompson, Brian D.

IPC: H05K3/28 ,  H05K3/30

CPC classification number: H05K3/303 ,  H01L21/563 ,  H01L23/3121 ,  H01L2224/16225 ,  H01L2224/73203 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1433 ,  H01L2924/19041 ,  H05K3/284 ,  H05K2201/10674 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00 ,  H01L2224/0401

Abstract: An electronic module (100) includes a substrate (108), at least one surface mounted integrated circuit (IC) component (110) and an underfill material (122). The substrate (108) includes a plurality of electrically conductive traces (118A,118B), formed on at least one surface of the substrate (108), and the component (110) is electrically coupled to at least one of the conductive traces (118A,118B). The underfill material (122) is positioned between the component (110) and the substrate (108) and provides at least one pedestal that supports the component (110) during encapsulation. The underfill material (122), when cured, maintains the integrity of the electrical connections between the component (110) and the conductive traces (118A,118B).

Abstract translation: 电子模块（100）包括衬底（108），至少一个表面安装集成电路（IC）部件（110）和底部填充材料（122）。 衬底（108）包括形成在衬底（108）的至少一个表面上的多个导电迹线（118A，118B），并且部件（110）电耦合到导电迹线（118A）中的至少一个 ，118B）。 底部填充材料（122）位于部件（110）和基板（108）之间，并且提供至少一个在封装期间支撑部件（110）的基座。 底部填充材料（122）在固化时保持部件（110）和导电迹线（118A，118B）之间的电连接的完整性。