公开(公告)号：US20150013905A1

公开(公告)日：2015-01-15

申请号：US14326439

申请日：2014-07-08

Applicant: EBARA CORPORATION

Inventor： Yoichi NAKAGAWA ,  Yoshitaka MUKAIYAMA ,  Junitsu YAMAKAWA

IPC: C23C18/16 ,  C23F1/08 ,  C25D17/06

CPC classification number: C23C18/1632 ,  C23C18/1619 ,  C23F1/08 ,  C25D17/001 ,  C25D17/06 ,  H01L21/67086 ,  H01L21/67757

Abstract: A wet processing apparatus, such as a plating apparatus, and an etching apparatus, is disclosed. A wet processing apparatus includes a substrate-holder advancing mechanism configured to elevate a movable support to raise a substrate holder until the substrate holder is separated from a fixed support, move the movable support together with the substrate holder by a predetermined distance toward a holder takeout position, lower the movable support until the substrate holder is supported on the fixed support and the movable support is separated from the substrate holder, and move the movable support by the predetermined distance toward a holder put-in position.

Abstract translation: 公开了诸如电镀设备和蚀刻设备之类的湿处理设备。 湿处理装置包括：基板保持器前进机构，其构造成升高可移动支撑件以升高基板保持器直到基板保持件与固定支撑件分离，将可移动支撑件与基板保持器一起保持预定距离朝向保持器取出 使可动支撑件下降，直到基板支架支撑在固定支撑件上，并且可移动支撑件与基板支架分离，并将可移动支撑件移动预定距离朝向支架放置位置。

公开(公告)号：US20190181026A1

公开(公告)日：2019-06-13

申请号：US16217936

申请日：2018-12-12

Applicant: EBARA CORPORATION

Inventor： Junitsu YAMAKAWA ,  Takuya TSUSHIMA

IPC: H01L21/67 ,  G05B19/402 ,  G06T7/73 ,  C25D21/12 ,  C25D17/00

Abstract: A substrate processing device for processing a substrate, comprising an image sensor configured to detect positions of two corners on at least one diagonal of a substrate when the substrate is transferred to a predetermined position; an illuminating device that can be disposed so as to illuminate the two corners of the substrate on an opposite side of the substrate at the predetermined position relative to the image sensor; and a control device configured to determine the position of the substrate on the basis of the positions of the two corners, which are detected by the image sensor, the control device being configured to be capable of changing at least either light quantity or wavelength of output light of the illuminating device.

公开(公告)号：US20190084777A1

公开(公告)日：2019-03-21

申请号：US16084948

申请日：2017-03-07

Applicant: EBARA CORPORATION

Inventor： Yoshitaka MUKAIYAMA ,  Toshio YOKOYAMA ,  Junitsu YAMAKAWA ,  Takuya TSUSHIMA ,  Tomonori HIRAO ,  Sho TAMURA ,  Hirotaka OHASHI

IPC: B65G49/02 ,  C25D17/08 ,  H01L21/683 ,  H05K3/18 ,  C25D17/00 ,  B65G47/52

Abstract: To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.

公开(公告)号：US20180286730A1

公开(公告)日：2018-10-04

申请号：US15684365

申请日：2017-08-23

Applicant: EBARA CORPORATION

Inventor： Junitsu YAMAKAWA ,  Takuya TSUSHIMA

IPC: H01L21/68 ,  G01B11/00 ,  C25D17/06 ,  C25D17/00 ,  C25D21/12

CPC classification number: H01L21/681 ,  C25D17/001 ,  C25D17/06 ,  C25D21/12 ,  G01B11/002

Abstract: A substrate processing device for processing a substrate, comprising: an image sensor for detecting positions of two corners on at least one diagonal line of a substrate when the substrate is moved to a predetermined position; an illuminating device that can be disposed so as to illuminate the two corners of the substrate on an opposite side of the substrate at the predetermined position to the image sensor; and a control device for determining the position of the substrate, based on the positions of the two corners detected by the image sensor.

公开(公告)号：US20170370016A1

公开(公告)日：2017-12-28

申请号：US15636041

申请日：2017-06-28

Applicant: EBARA CORPORATION

Inventor： Junitsu YAMAKAWA

IPC: C25D17/00 ,  H01L21/02 ,  B08B5/02 ,  B08B3/04 ,  C25D21/08 ,  B08B3/02 ,  H01L21/288

CPC classification number: C25D17/001 ,  B08B3/022 ,  B08B3/04 ,  B08B5/023 ,  C25D21/08 ,  H01L21/02068 ,  H01L21/2885 ,  H05K3/0085 ,  H05K3/26 ,  H05K2203/075

Abstract: A cleaning apparatus is provided. This cleaning apparatus includes an inlet, an outlet, a first conveyance path, a second conveyance path, a cleaning unit disposed on the first conveyance path and configured to clean the target object in a non-contacting manner, and a drying unit disposed on the first conveyance path and configured to dry the target object in a non-contacting manner. The first conveyance path and the second conveyance path are vertically arranged side by side. The second conveyance path is positioned above the first conveyance path and connected with the outlet at an end point. The second conveyance path functions as a stocker configured to temporarily store the target object.