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公开(公告)号：US20180223444A1
公开(公告)日：2018-08-09
申请号：US15868673
申请日：2018-01-11
Applicant: EBARA CORPORATION
Inventor： Toshio YOKOYAMA , Tomonori HIRAO , Sho TAMURA
IPC: C25D17/00 , C25D17/06 , C25D5/10 , C25D5/02 , H01L21/288
CPC classification number: C25D17/004 , C25D5/028 , C25D5/10 , C25D17/001 , C25D17/005 , C25D17/008 , C25D17/06 , H01L21/2885
Abstract: The present invention provides a plating apparatus capable of individually controlling a plating process on a front surface and a back surface of a substrate and a substrate holder usable for such a plating apparatus. A substrate holder for holding a substrate which is a plating target during a plating process is provided and such a substrate holder includes a body part for holding the substrate, provided with a first opening and a second opening, the body part is configured such that when the body part holds the substrate, a plated region on the front surface of the substrate is exposed through the first opening and a plated region on the back surface of the substrate is exposed through the second opening and a sealing part that protrudes from a peripheral portion is included in at least part of the peripheral portion of the body part.
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公开(公告)号：US20190084777A1
公开(公告)日：2019-03-21
申请号：US16084948
申请日：2017-03-07
Applicant: EBARA CORPORATION
Inventor： Yoshitaka MUKAIYAMA , Toshio YOKOYAMA , Junitsu YAMAKAWA , Takuya TSUSHIMA , Tomonori HIRAO , Sho TAMURA , Hirotaka OHASHI
Abstract: To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.
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