公开(公告)号：US20180182659A1

公开(公告)日：2018-06-28

申请号：US15851655

申请日：2017-12-21

Applicant: EBARA CORPORATION

Inventor： Toshio YOKOYAMA ,  Yoshitaka MUKAIYAMA ,  Takuya TSUSHIMA

IPC: H01L21/687 ,  C25D17/06 ,  C25D17/00

CPC classification number: H01L21/68728 ,  C25D17/001 ,  C25D17/06 ,  H01L21/68764

Abstract: A substrate attachment/detachment device which clamps and holds a substrate by means of first and second retaining members of a substrate holder, the device comprising a first holder retainer configured to hold the first retaining member in a first posture; and a second holder retainer configured to be movable in a linear manner toward and away from the first holder retainer, capable of holding the second retaining member in the first posture and a second posture which is substantially orthogonal to the first posture, configured to push the second retaining member against the first retaining member in the first posture to lock the first and second retaining members to each other.

公开(公告)号：US20190181026A1

公开(公告)日：2019-06-13

申请号：US16217936

申请日：2018-12-12

Applicant: EBARA CORPORATION

Inventor： Junitsu YAMAKAWA ,  Takuya TSUSHIMA

IPC: H01L21/67 ,  G05B19/402 ,  G06T7/73 ,  C25D21/12 ,  C25D17/00

Abstract: A substrate processing device for processing a substrate, comprising an image sensor configured to detect positions of two corners on at least one diagonal of a substrate when the substrate is transferred to a predetermined position; an illuminating device that can be disposed so as to illuminate the two corners of the substrate on an opposite side of the substrate at the predetermined position relative to the image sensor; and a control device configured to determine the position of the substrate on the basis of the positions of the two corners, which are detected by the image sensor, the control device being configured to be capable of changing at least either light quantity or wavelength of output light of the illuminating device.

公开(公告)号：US20190084777A1

公开(公告)日：2019-03-21

申请号：US16084948

申请日：2017-03-07

Applicant: EBARA CORPORATION

Inventor： Yoshitaka MUKAIYAMA ,  Toshio YOKOYAMA ,  Junitsu YAMAKAWA ,  Takuya TSUSHIMA ,  Tomonori HIRAO ,  Sho TAMURA ,  Hirotaka OHASHI

IPC: B65G49/02 ,  C25D17/08 ,  H01L21/683 ,  H05K3/18 ,  C25D17/00 ,  B65G47/52

Abstract: To provide a substrate holder and a plating apparatus that can easily position a substrate. A substrate holder includes a substrate holding body for holding a substrate, and a first holding member and a second holding member that interpose and hold the substrate holding body therebetween, and the first holding member includes an opening portion through which the plating target surface of the substrate is exposed, and a power supply member configured to be in contact with a plating target surface of the substrate.

公开(公告)号：US20180286730A1

公开(公告)日：2018-10-04

申请号：US15684365

申请日：2017-08-23

Applicant: EBARA CORPORATION

Inventor： Junitsu YAMAKAWA ,  Takuya TSUSHIMA

IPC: H01L21/68 ,  G01B11/00 ,  C25D17/06 ,  C25D17/00 ,  C25D21/12

CPC classification number: H01L21/681 ,  C25D17/001 ,  C25D17/06 ,  C25D21/12 ,  G01B11/002

Abstract: A substrate processing device for processing a substrate, comprising: an image sensor for detecting positions of two corners on at least one diagonal line of a substrate when the substrate is moved to a predetermined position; an illuminating device that can be disposed so as to illuminate the two corners of the substrate on an opposite side of the substrate at the predetermined position to the image sensor; and a control device for determining the position of the substrate, based on the positions of the two corners detected by the image sensor.