公开(公告)号：US20180056470A1

公开(公告)日：2018-03-01

申请号：US15688281

申请日：2017-08-28

Applicant: EBARA CORPORATION

Inventor： Masayoshi IMAI ,  Katsuhiko TOKUSHIGE ,  Suguru OGURA ,  Katsuhide WATANABE ,  Junji KUNISAWA ,  Takeshi IIZUMI ,  Mitsuru MIYAZAKI

IPC: B24B5/35 ,  B08B3/10 ,  B24B57/02 ,  B08B3/08 ,  B08B3/02 ,  C01B15/01 ,  C11D11/00 ,  C11D7/34

CPC classification number: B24B5/35 ,  B08B3/024 ,  B08B3/08 ,  B08B3/10 ,  B24B57/02 ,  C01B15/01 ,  C11D3/3947 ,  C11D7/06 ,  C11D7/08 ,  C11D7/34 ,  C11D11/0064

Abstract: A substrate processing apparatus includes a polisher configured to polish a substrate using a polishing liquid, a first cleaner configured to clean the substrate polished by the polisher using sulfuric acid and hydrogen peroxide water, a second cleaner configured to clean the substrate cleaned by the first cleaner using a basic chemical liquid and hydrogen peroxide water, and a drier configured to dry the substrate cleaned by the second cleaner.