公开(公告)号：WO2008142081A9

公开(公告)日：2009-04-23

申请号：PCT/EP2008056200

申请日：2008-05-20

Applicant: EPCOS AG ,  MAIER MARTIN ,  OBESSER MICHAEL ,  KASTNER KONRAD ,  PORTMANN JUERGEN ,  BAUERNSCHMITT ULRICH

Inventor： MAIER MARTIN ,  OBESSER MICHAEL ,  KASTNER KONRAD ,  PORTMANN JUERGEN ,  BAUERNSCHMITT ULRICH

IPC: H01L23/485

CPC classification number: H01L24/05 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention relates to a component with multi-layered connection surfaces that can be soldered or bonded to a substrate (SU). Said component has, in addition to the electrically conductive pad metallisation (PM) and the UBM-metallisation (UBM), an electrically conductive stress compensation layer (SK) that is arranged between the substrate and pad-metallisation or between the pad-metallisation and the UBM-metallisation. The stress insensitivity of the connection metallisation is obtained by a stress compensation layer, the E-module thereof being lower than that of the UBM-metallisation.

Abstract translation: 它提出了一种基底（SU），在具有多层可焊接或粘合的衬垫的装置，其除了所述导电焊盘金属（PM）和UBM金属化（UBM）另外的导电应力补偿层（SK），则 在衬底和焊盘金属化之间或焊盘金属化和UBM金属化之间布置。 端子金属化的应力不敏感性通过其E模块低于UBM金属化的应力补偿层来实现。

公开(公告)号：WO2008142081A3

公开(公告)日：2009-03-05

申请号：PCT/EP2008056200

申请日：2008-05-20

Applicant: EPCOS AG ,  MAIER MARTIN ,  OBESSER MICHAEL ,  KASTNER KONRAD ,  PORTMANN JUERGEN ,  BAUERNSCHMITT ULRICH

Inventor： MAIER MARTIN ,  OBESSER MICHAEL ,  KASTNER KONRAD ,  PORTMANN JUERGEN ,  BAUERNSCHMITT ULRICH

IPC: H01L23/485

CPC classification number: H01L24/05 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/0236 ,  H01L2224/0239 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05001 ,  H01L2224/0554 ,  H01L2224/05552 ,  H01L2224/05555 ,  H01L2924/01005 ,  H01L2924/0101 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01061 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/1461 ,  H01L2924/19043 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

Abstract: The invention relates to a component with multi-layered connection surfaces that can be soldered or bonded to a substrate (SU). Said component has, in addition to the electrically conductive pad metallisation (PM) and the UBM-metallisation (UBM), an electrically conductive stress compensation layer (SK) that is arranged between the substrate and pad-metallisation or between the pad-metallisation and the UBM-metallisation. The stress insensitivity of the connection metallisation is obtained by a stress compensation layer, the E-module thereof being lower than that of the UBM-metallisation.

Abstract translation: 它提出了一种基底（SU），在具有多层可焊接或粘合的衬垫的装置，其除了所述导电焊盘金属（PM）和UBM金属化（UBM）另外的导电应力补偿层（SK），则 设置在基板和焊盘金属之间或焊盘金属化和UBM之间的金属化。 连接金属化的应力不敏感由应力补偿层，其模量比UBM金属化下实现的。

公开(公告)号：DE102007023590A1

公开(公告)日：2008-11-27

申请号：DE102007023590

申请日：2007-05-21

Applicant: EPCOS AG

Inventor： MAIER MARTIN ,  KASTNER KONRAD ,  OBESSER MICHAEL ,  PORTMANN JUERGEN ,  BAUERNSCHMITT ULRICH

IPC: H01L23/482

公开(公告)号：DE102005009358A1

公开(公告)日：2006-09-07

申请号：DE102005009358

申请日：2005-03-01

Applicant: EPCOS AG

Inventor： KASTNER KONRAD ,  OBESSER MICHAEL ,  HAMMEDINGER ROBERT ,  MAIER MARTIN

IPC: H01R4/02 ,  H01R43/02 ,  H05K3/32

Abstract: A solderable contact for use with an electrical component includes a pad metallization on a substrate, and an under bump metallization over at least part of the pad metallization. The under bump metallization is in an area for receiving solder. The pad metallization is structured to reveal parts of the substrate surface. The under bump metallization is in direct contact with the parts of the substrate.

公开(公告)号：DE102008020783A1

公开(公告)日：2009-10-29

申请号：DE102008020783

申请日：2008-04-25

Applicant: EPCOS AG

Inventor： FREISLEBEN STEFAN ,  HOFMANN MIRA ,  MAIER MARTIN ,  BAUERNSCHMITT ULRICH

IPC: H03H9/64