Abstract:
The present invention concerns a transducer element (1) which comprises a substrate (5) which comprises a cavity (23) extending through the substrate (5), a backplate (3) which is arranged in the cavity (23) of the substrate (5) and a membrane (2) which is movable relative to the backplate (3). Further, the present invention concerns a method of manufacturing a transducer element (1).
Abstract:
The present invention concerns a microphone (1) which comprises a substrate (7), a transducer element (2) defining a front volume (5), a lid (10) arranged such that the transducer element (2) is arranged between the substrate (7) and the lid (10), wherein the lid (10) comprises an opening (12) which is arranged non-overlapping to the front volume (5) of the transducer element (2), and an insert (13) which is arranged between the lid (10) and the transducer element (2), wherein the insert (13) comprises a path (14) which connects the front volume (5) of the transducer element (2) to the opening (12) of the lid (10). Moreover, the present invention concerns a method of manufacturing a microphone (1).
Abstract:
A MEMS microphone with reduced parasitic capacitance is provided. Therefore, a microphone comprises a protection film covering a rim-sided area of the backplate.
Abstract:
A MEMS microphone having reduced parasitic capacitance is provided. Therefore, the microphone comprises a trench electrically separating an acoustically active section of the backplate from an acoustically inactive section of the backplate.
Abstract:
Die vorliegende Erfindung betrifft ein Mikrofon (1), das ein Substrat (8), ein Wandlerelement (2), das auf dem Substrat (8) angeordnet ist,einen Deckel (11) mit einer Öffnung (13), wobei die Öffnung (13) des Deckels (11) das Wandlerelement (2) vollständig überdeckt, und einer Schalltrennung (14), die den Deckel (11) an dem Wandlerelement (2) befestigt, aufweist.
Abstract:
An top-port MEMS microphone TPMM allowing further miniaturization while maintaining a good performance is provided. The microphone comprises an MEMS chip MC with a monolithically connected protection element PE at the upper side enhancing the mechanical stability of the MEMS chip.
Abstract:
A MEMS backplate enabling MEMS microphones with reduced parasitic capacitance is provided. Therefore, the backplate comprises apertures in a suspension area.
Abstract:
A microphone and a method for manufacturing a microphone are disclosed. In an embodiment the microphone includes a substrate, a transducer element defining a front volume and a lid arranged such that the transducer element is arranged between the substrate and the lid, wherein the lid comprises an opening which is arranged non-overlapping to the front volume of the transducer element. The microphone further includes an insert arranged between the lid and the transducer element, wherein the insert includes a path which connects the front volume of the transducer element to the opening of the lid.