公开(公告)号：WO2012016898A3

公开(公告)日：2012-06-07

申请号：PCT/EP2011062919

申请日：2011-07-27

Applicant: EPCOS AG ,  REITLINGER CLAUS ,  ZELLER GERHARD

Inventor： REITLINGER CLAUS ,  ZELLER GERHARD

IPC: H01L23/552

CPC classification number: H05K9/0024 ,  H01L23/552 ,  H01L24/73 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/1815 ,  H01L2924/19107 ,  H01L2924/30107 ,  H01L2924/3025 ,  H05K1/0204 ,  H05K3/22 ,  H05K9/003 ,  Y10T29/49124 ,  H01L2924/00012 ,  H01L2924/00

Abstract: An electronic device comprises a substrate (120), at least one electronic component (171, 172, 173) arranged on the substrate, and an encapsulation (140) covering the at least one electronic component (171, 172, 173). An electromagnetic protective layer (130) covers a surface (143) of the encapsulation (140) that faces away from the substrate (120), and the side faces (121, 141; 122, 142) directed transversely with respect to the surface (143). In particular, a thermal and/or electrical coupling (134, 162, 163, 164, 165, 166) couples the electromagnetic protective layer (130) thermally and/or electrically to a region (168) of the electronic device (111, 112) that is enclosed by the encapsulation. For production purposes, the device is singulated from a panel and the electromagnetic protective layer (130) is subsequently applied.

Abstract translation: 一种电子部件，包括设置在所述基板上的基板（120），至少一个电子部件（171，172，173），以及封装（140），其覆盖至少一个电子部件（171，172，173） ， 从封装（140）和所述侧表面的表面（143）相背离的电磁保护层（130）覆盖衬底（120）（121，141; 122，142）横向于所述表面（143）被引导。 特别地，热和/或电联接器（134，162，163，164，165，166）耦合的电磁保护层（130）的热和/或电（与由电子部件的封装部分（168）包围的空间111，112 ）。 为了生产，将部件与面板分离，然后施加电磁保护层（130）。

公开(公告)号：DE10246784A1

公开(公告)日：2004-04-22

申请号：DE10246784

申请日：2002-10-08

Applicant: EPCOS AG

Inventor： FEIERTAG GREGOR ,  REITLINGER CLAUS ,  KRUEGER HANS ,  HAUSER MARKUS ,  SYNOWCYK ANDREAS ,  HAMMEDINGER ROBERT ,  ROTTMANN MATTHIAS ,  KASTNER KONRAD ,  BLEYL INGO ,  STELZL ALOIS

IPC: H03H9/02 ,  H03H9/05 ,  H03H9/08 ,  H01L27/20 ,  H03H3/00 ,  H03H3/08 ,  H03H9/145 ,  H03H9/15 ,  H03H9/25

Abstract: A component operating with acoustic waves comprises a chip electrically and mechanically connected to a supporting substrate by solder connections, and electrically conducting structures arranged on the chip and having outer contacts (AK) and feed lines (ZL). A part of the electrically conducting structures have a resonator operating with acoustic volume waves and/or a converter operating with acoustic surface waves. The resonator or converter is connected to a further resonator or converter or to the outer contacts using the feed lines. An Independent claim is also included for a process for improving the ohmic losses of a component having conducting structures on its surface.