公开(公告)号：DE19933548A1

公开(公告)日：2001-01-25

申请号：DE19933548

申请日：1999-07-16

Applicant: EPCOS AG

Inventor： ROTTMANN MATTHIAS ,  PAHL WOLFGANG

IPC: H01L23/00 ,  H03H9/02 ,  H01L23/29 ,  H01L21/56 ,  H01L23/52 ,  H03H9/25

Abstract: Electronic component (1) has a substrate plate (10) and an electrical conductor structure (12, 13). The substrate plate is covered with a tin dioxide layer (16) as passivating layer in the region to be passivated over the conductor structure. An Independent claim is also included for a process for the production of a tin dioxide layer on a surface of a substrate plate over conductor structures comprising photolytic oxidation of a tin IV compound to form tin dioxide.

公开(公告)号：DE19933548C2

公开(公告)日：2001-07-26

申请号：DE19933548

申请日：1999-07-16

Applicant: EPCOS AG

Inventor： ROTTMANN MATTHIAS ,  PAHL WOLFGANG

IPC: H01L23/00 ,  H03H9/02 ,  H01L23/29 ,  H01L21/56 ,  H01L23/52 ,  H03H9/25

公开(公告)号：DE10246784A1

公开(公告)日：2004-04-22

申请号：DE10246784

申请日：2002-10-08

Applicant: EPCOS AG

Inventor： FEIERTAG GREGOR ,  REITLINGER CLAUS ,  KRUEGER HANS ,  HAUSER MARKUS ,  SYNOWCYK ANDREAS ,  HAMMEDINGER ROBERT ,  ROTTMANN MATTHIAS ,  KASTNER KONRAD ,  BLEYL INGO ,  STELZL ALOIS

IPC: H03H9/02 ,  H03H9/05 ,  H03H9/08 ,  H01L27/20 ,  H03H3/00 ,  H03H3/08 ,  H03H9/145 ,  H03H9/15 ,  H03H9/25

Abstract: A component operating with acoustic waves comprises a chip electrically and mechanically connected to a supporting substrate by solder connections, and electrically conducting structures arranged on the chip and having outer contacts (AK) and feed lines (ZL). A part of the electrically conducting structures have a resonator operating with acoustic volume waves and/or a converter operating with acoustic surface waves. The resonator or converter is connected to a further resonator or converter or to the outer contacts using the feed lines. An Independent claim is also included for a process for improving the ohmic losses of a component having conducting structures on its surface.