High brightness light emitting diode structure
    2.
    发明授权
    High brightness light emitting diode structure 有权
    高亮度发光二极管结构

    公开(公告)号:US09112117B2

    公开(公告)日:2015-08-18

    申请号:US13836681

    申请日:2013-03-15

    Abstract: A light-emitting diode structure comprising: a substrate; a light-emitting semiconductor stack on the substrate, wherein the light-emitting semiconductor stack comprises a first semiconductor layer, a second semiconductor layer with different polarity from the first semiconductor layer, and a light-emitting layer between the first semiconductor layer and the second semiconductor layer; a first electrical pad on the substrate, wherein the first electrical pad is apart from the light-emitting semiconductor stack and electrically connects to the first semiconductor layer; and a second electrical pad on the substrate, wherein the second electrical pad is apart from the light-emitting semiconductor stack and electrically connects to the second semiconductor layer, wherein the first electrical pad and the second electrical pad are not higher than the light-emitting semiconductor stack.

    Abstract translation: 一种发光二极管结构,包括:基板; 在所述基板上的发光半导体堆叠,其中,所述发光半导体堆叠包括第一半导体层,与所述第一半导体层具有不同极性的第二半导体层,以及所述第一半导体层与所述第二半导体层之间的发光层 半导体层; 在所述基板上的第一电焊盘,其中所述第一电焊盘与所述发光半导体堆叠分离并且电连接到所述第一半导体层; 以及在所述基板上的第二电焊盘,其中所述第二电焊盘离开所述发光半导体堆叠并且电连接到所述第二半导体层,其中所述第一电焊盘和所述第二电焊盘不高于所述发光 半导体堆叠

    Light emitting device
    3.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号:US09293656B2

    公开(公告)日:2016-03-22

    申请号:US13854212

    申请日:2013-04-01

    CPC classification number: H01L33/42 H01L33/0095 H01L33/22 H01L33/40 H01L33/405

    Abstract: A light-emitting device, comprising: a substrate; a semiconductor stacking layer comprising a first type semiconductor layer on the substrate, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer; and an electrode structure on the second semiconductor layer, wherein the electrode structure comprises a bonding layer, a conductive layer, and a first barrier layer between the bonding layer and the conductive layer; wherein the conductive layer has higher standard oxidation potential than that of the bonding layer.

    Abstract translation: 1.一种发光装置,包括:基板; 半导体堆叠层,包括在所述衬底上的第一类型半导体层,所述第一半导体层上的有源层和所述有源层上的第二半导体层; 以及在所述第二半导体层上的电极结构,其中所述电极结构包括在所述接合层和所述导电层之间的接合层,导电层和第一阻挡层; 其中导电层具有比接合层更高的标准氧化电位。

    Light Emitting Device
    4.
    发明申请
    Light Emitting Device 有权
    发光装置

    公开(公告)号:US20140124807A1

    公开(公告)日:2014-05-08

    申请号:US13854212

    申请日:2013-04-01

    CPC classification number: H01L33/42 H01L33/0095 H01L33/22 H01L33/40 H01L33/405

    Abstract: A light-emitting device, comprising: a substrate; a semiconductor stacking layer comprising a first type semiconductor layer on the substrate, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer; and an electrode structure on the second semiconductor layer, wherein the electrode structure comprises a bonding layer, a conductive layer, and a first barrier layer between the bonding layer and the conductive layer; wherein the conductive layer has higher standard oxidation potential than that of the bonding layer.

    Abstract translation: 1.一种发光装置,包括:基板; 半导体堆叠层,包括在所述衬底上的第一类型半导体层,所述第一半导体层上的有源层和所述有源层上的第二半导体层; 以及在所述第二半导体层上的电极结构,其中所述电极结构包括在所述接合层和所述导电层之间的接合层,导电层和第一阻挡层; 其中导电层具有比接合层更高的标准氧化电位。

    LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
    5.
    发明申请
    LIGHT EMITTING DEVICE AND MANUFACTURING METHOD THEREOF 有权
    发光装置及其制造方法

    公开(公告)号:US20140048830A1

    公开(公告)日:2014-02-20

    申请号:US13729842

    申请日:2012-12-28

    CPC classification number: H01L33/22 H01L31/02363 H01L33/0095

    Abstract: A method of fabricating a light-emitting device comprising steps of: providing a substrate, an active layer, and a first semiconductor layer between the substrate and the active layer; removing part of the active layer; and forming a rough structure in the first semiconductor layer while keeping the active layer attached to the substrate.

    Abstract translation: 一种制造发光器件的方法,包括以下步骤:在衬底和有源层之间提供衬底,有源层和第一半导体层; 去除活性层的一部分; 并在第一半导体层中形成粗糙结构,同时保持活性层附着在基板上。

    Light emitting device having multi-layered electrode structure
    8.
    发明授权
    Light emitting device having multi-layered electrode structure 有权
    具有多层电极结构的发光器件

    公开(公告)号:US09530948B2

    公开(公告)日:2016-12-27

    申请号:US15049917

    申请日:2016-02-22

    Abstract: A light-emitting device, comprising: a substrate; a semiconductor stacking layer comprising a first type semiconductor layer on the substrate, an active layer on the first semiconductor layer, and a second semiconductor layer on the active layer; and an electrode structure on the second semiconductor layer, wherein the electrode structure comprises a bonding layer, a conductive layer, and a first barrier layer between the bonding layer and the conductive layer; wherein the conductive layer has higher standard oxidation potential than that of the bonding layer.

    Abstract translation: 1.一种发光装置,包括:基板; 半导体堆叠层,包括在所述衬底上的第一类型半导体层,所述第一半导体层上的有源层和所述有源层上的第二半导体层; 以及在所述第二半导体层上的电极结构,其中所述电极结构包括在所述接合层和所述导电层之间的接合层,导电层和第一阻挡层; 其中导电层具有比接合层更高的标准氧化电位。

    Light emitting device
    10.
    发明授权
    Light emitting device 有权
    发光装置

    公开(公告)号:US09166105B2

    公开(公告)日:2015-10-20

    申请号:US13729842

    申请日:2012-12-28

    CPC classification number: H01L33/22 H01L31/02363 H01L33/0095

    Abstract: A light-emitting device includes: a substrate; a first semiconductor layer disposed on the substrate and having a first surface; a rough structure formed in the first semiconductor layer, the rough structure comprising porous structures formed therein and a portion of the porous structures having openings exposed on the first surface of the first semiconductor layer; and an active layer formed on the first semiconductor layer.

    Abstract translation: 发光装置包括:基板; 设置在所述基板上并具有第一表面的第一半导体层; 形成在所述第一半导体层中的粗糙结构,所述粗糙结构包括在其中形成的多孔结构,并且所述多孔结构的一部分具有暴露在所述第一半导体层的第一表面上的开口; 以及形成在第一半导体层上的有源层。

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