公开(公告)号：US20180006206A1

公开(公告)日：2018-01-04

申请号：US15702286

申请日：2017-09-12

Applicant: EPISTAR CORPORATION

Inventor： Chien-Fu HUANG ,  Yao-Ning CHAN ,  Tzu Chieh HSU ,  Yi-ming CHEN ,  Hsin-Chih CHIU ,  Chih-Chiang LU ,  Chia-liang HSU ,  Chun-Hsien CHANG

IPC: H01L33/62 ,  H01L33/00 ,  H01L25/16 ,  H01L33/38

CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0066

Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks comprising a first semiconductor stacked block and a second semiconductor stacked block on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; conducting a separating step to separate the first semiconductor stacked block from the first substrate, and the second semiconductor stacked block remains on the first substrate; providing an element substrate comprising a patterned metal layer; and conducting a bonding step to bond and align the first semiconductor stacked block or the second semiconductor stacked block with the patterned metal layer.

公开(公告)号：US20170236988A1

公开(公告)日：2017-08-17

申请号：US15484896

申请日：2017-04-11

Applicant: EPISTAR CORPORATION

Inventor： Chia-Liang HSU ,  Yi-ming CHEN ,  Hsin-Chih CHIU

IPC: H01L33/62 ,  H01L33/00 ,  H01L33/32 ,  H01L33/46 ,  H01L33/64

CPC classification number: H01L33/62 ,  B65G47/24 ,  H01L21/67092 ,  H01L21/68 ,  H01L21/681 ,  H01L22/26 ,  H01L33/0079 ,  H01L33/02 ,  H01L33/32 ,  H01L33/46 ,  H01L33/641

Abstract: A light-emitting device comprises a semiconductor light-emitting stack comprising a first connecting layer; and a substrate under the semiconductor light-emitting stack, wherein the substrate comprises a second connecting layer connecting the first connecting layer; wherein the first connecting layer comprises a first region, a first pattern, and a first connecting surface; wherein a difference of a reflectivity between the first pattern and the first region is larger than 20%; wherein the second connecting layer comprises a second region and a side of the first pattern fully contact the second region.