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    LIGHT-EMITTING DEVICE
    1.
    发明申请
    LIGHT-EMITTING DEVICE 审中-公开

    公开(公告)号：US20200287075A1

    公开(公告)日：2020-09-10

    申请号：US16883742

    申请日：2020-05-26

    Applicant: EPISTAR CORPORATION

    Inventor： Chien-Fu HUANG ,  Chih-Chiang LU ,  Chun-Yu LIN ,  Hsin-Chih CHIU

    IPC: H01L33/02 ,  H01L21/66 ,  H01L33/62 ,  H01L25/075 ,  H01L23/00

    Abstract: The present disclosure provides a light-emitting device comprising a substrate with a topmost surface; a first semiconductor stack arranged on the substrate, and comprising a first top surface separated from the topmost surface by a first distance; a first bonding layer arranged between the substrate and the first semiconductor stack; a second semiconductor stack arranged on the substrate, and comprising a second top surface separated from the topmost surface by a second distance which is different form the first distance; a second bonding layer arranged between the substrate and the second semiconductor stack; a third semiconductor stack arranged on the substrate, and comprising third top surface separated from the topmost surface by a third distance; and a third bonding layer arranged between the substrate and the third semiconductor stack; wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are configured to emit different color lights.

    LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THEREOF
    5.
    发明申请
    LIGHT-EMITTING DEVICE AND METHOD OF MANUFACTURING THEREOF 有权
    发光装置及其制造方法

    公开(公告)号：US20160218247A1

    公开(公告)日：2016-07-28

    申请号：US14902795

    申请日：2013-07-05

    Applicant: EPISTAR CORPORATION

    Inventor： Chien-Fu HUANG ,  Yao-Ning CHAN ,  Tzu Chieh HSU ,  Yi Ming CHEN ,  Hsin-Chih CHIU ,  Chih-Chiang LU ,  Chia-Liang HSU ,  Chun-Hsien CHANG

    IPC: H01L33/48 ,  H01L33/38

    CPC classification number: H01L33/62 ,  H01L25/167 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/38 ,  H01L33/385 ,  H01L33/48 ,  H01L2933/0016 ,  H01L2933/0033 ,  H01L2933/0066

    Abstract: The present disclosure provides a method of manufacturing a light-emitting device, which comprises providing a first substrate and a plurality of semiconductor stacked blocks on the first substrate, and each of the plurality semiconductor stacked blocks comprises a first conductive-type semiconductor layer, a light-emitting layer on the first conductive-type semiconductor layer, and a second conductive-type semiconductor layer on the light-emitting layer; wherein there is a trench separating two adjacent semiconductor stacked blocks on the first substrate, and a width of the trench is less than 10 μm; and conducting a first separating step to separate a first semiconductor stacked block of the plurality of semiconductor stacked blocks from the first substrate and keep a second semiconductor stacked block on the first substrate.

    Abstract translation: 本公开提供一种制造发光器件的方法，其包括在第一衬底上提供第一衬底和多个半导体堆叠块，并且多个半导体堆叠块中的每一个包括第一导电型半导体层， 第一导电型半导体层上的发光层和发光层上的第二导电型半导体层; 其中在所述第一基板上存在分隔两个相邻的半导体层叠块的沟槽，并且所述沟槽的宽度小于10μm; 并且进行第一分离步骤以将多个半导体堆叠块的第一半导体堆叠块与第一衬底分离，并将第二半导体堆叠块保持在第一衬底上。

    LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
    7.
    发明申请
    LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20190296186A1

    公开(公告)日：2019-09-26

    申请号：US16436544

    申请日：2019-06-10

    Applicant: EPISTAR CORPORATION

    Inventor： Chien-Fu HUANG ,  Chih-Chiang LU ,  Chun-Yu LIN ,  Hsin-Chih CHIU

    IPC: H01L33/02 ,  H01L23/00 ,  H01L25/075 ,  H01L33/62 ,  H01L21/66

    Abstract: The present disclosure provides a light-emitting device comprises a substrate with a topmost surface; a first semiconductor stack arranged on the substrate, and comprising a first light-emitting layer separated from the topmost surface by a first distance; a second semiconductor stack arranged on the substrate, and comprising a second light-emitting layer separated from the topmost surface by a second distance; and a third semiconductor stack arranged on the substrate, and comprising third light-emitting layer separated from the topmost surface by a third distance; wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are configured to emit different color lights; and wherein the second distance is different form the first distance and the third distance.

    LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF
    8.
    发明申请
    LIGHT-EMITTING DEVICE AND MANUFACTURING METHOD THEREOF 审中-公开

    公开(公告)号：US20170271548A1

    公开(公告)日：2017-09-21

    申请号：US15609795

    申请日：2017-05-31

    Applicant: EPISTAR CORPORATION

    Inventor： Chien-Fu HUANG ,  Chih-Chiang LU ,  Chun-Yu LIN ,  Hsin-Chih CHIU

    IPC: H01L33/02 ,  H01L25/075 ,  H01L33/62 ,  H01L21/66

    Abstract: The present disclosure provides a method for manufacturing a light-emitting device, comprising: providing a first substrate; providing a semiconductor stack on the first substrate, the semiconductor stack comprising a first conductive type semiconductor layer, a light-emitting layer on the first conductive type semiconductor layer, and a second conductive type semiconductor layer on the light-emitting layer, wherein the semiconductor stack comprises a plurality of blocks of semiconductor stack separated from each other, and wherein the plurality of blocks of semiconductor stack comprise a first block of semiconductor stack and a second block of semiconductor stack; performing a separating step to separate the first block of semiconductor stack from the first substrate, and the second block of semiconductor stack remained on the first substrate; providing a permanent substrate comprising a first surface, a second surface, and a third block of semiconductor stack on the first surface; and bonding one of the first block of semiconductor stack and the second block of semiconductor stack to the second surface of the permanent substrate; wherein the third block of semiconductor stack is separated from the first substrate, and one of the first block of semiconductor stack and the second block of semiconductor stack which is bonded to the permanent substrate and the third block of the semiconductor stack comprise different optical characteristic value or an electrical characteristic value.

    LIGHTING EMITTING DEVICE WITH ALIGNED-BONDING AND THE MANUFACTURING METHOD THEREOF
    9.
    发明申请
    LIGHTING EMITTING DEVICE WITH ALIGNED-BONDING AND THE MANUFACTURING METHOD THEREOF 有权
    具有对准接合的照明发光装置及其制造方法

    公开(公告)号：US20140048836A1

    公开(公告)日：2014-02-20

    申请号：US13784291

    申请日：2013-03-04

    Applicant: EPISTAR CORPORATION

    Inventor： Chia-Liang HSU ,  Yi-Ming CHEN ,  Hsin-Chih CHIU

    IPC: H01L33/02 ,  B65G47/24

    CPC classification number: H01L33/62 ,  B65G47/24 ,  H01L21/67092 ,  H01L21/68 ,  H01L21/681 ,  H01L22/26 ,  H01L33/0079 ,  H01L33/02 ,  H01L33/32 ,  H01L33/46 ,  H01L33/641

    Abstract: A light-emitting device comprises a semiconductor light-emitting stacked layer having a first connecting surface, wherein the semiconductor light-emitting stacked layer comprises a first alignment pattern on the first connecting surface, and a substrate under the semiconductor light-emitting stacked layer, wherein the substrate has a second connecting surface being operable for connecting with the first connecting surface, wherein the substrate comprises a second alignment pattern on the second connecting surface, and the second alignment pattern is corresponding to the first alignment pattern.

    Abstract translation: 发光器件包括具有第一连接表面的半导体发光层叠层，其中所述半导体发光层叠层包括在所述第一连接表面上的第一取向图案和所述半导体发光层叠层下的衬底， 其中所述基底具有可操作以与所述第一连接表面连接的第二连接表面，其中所述基底在所述第二连接表面上包括第二对准图案，并且所述第二对准图案对应于所述第一对准图案。

    LIGHT-EMITTING DEVICE
    10.
    发明申请
    LIGHT-EMITTING DEVICE 有权

    公开(公告)号：US20210367098A1

    公开(公告)日：2021-11-25

    申请号：US17397388

    申请日：2021-08-09

    Applicant: EPISTAR CORPORATION

    Inventor： Chien-Fu HUANG ,  Chih-Chiang LU ,  Chun-Yu LIN ,  Hsin-Chih CHIU

    IPC: H01L33/02 ,  H01L21/66 ,  H01L33/62 ,  H01L25/075 ,  H01L23/00

    Abstract: The present disclosure provides a light-emitting device comprising a substrate with a topmost surface; a first semiconductor stack arranged on the substrate, and comprising a first top surface separated from the topmost surface by a first distance; a first bonding layer arranged between the substrate and the first semiconductor stack; a second semiconductor stack arranged on the substrate, and comprising a second top surface separated from the topmost surface by a second distance which is different form the first distance; a second bonding layer arranged between the substrate and the second semiconductor stack; a third semiconductor stack arranged on the substrate, and comprising third top surface separated from the topmost surface by a third distance; and a third bonding layer arranged between the substrate and the third semiconductor stack; wherein the first semiconductor stack, the second semiconductor stack, and the third semiconductor stack are configured to emit different color lights.

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