Abstract:
A method, an associated structure, and an apparatus for multiple charged particle beam calibration and shielded charged particle lithography. A template defining an array of membranes is positioned above a target (e.g., a semiconductor wafer of the electron beams). Each membrane defines a through slot (opening) and a set of registration marks which are located with respec t to registration marks of the other membranes. Patterns are written onto the target by scanning each electron beam through its associated through slot. Intra- and inter-charged particle beam calibrations for each charged particl e beam are carried out using its associated set of registration marks. The template also suppresses undesirable electrical charging of any resist prese nt on the target during the exposure process.
Abstract:
A method and the associated apparatus for alignment and assembly of microlenses and microcolumns in which aligning structures such as rigid fibers are used to precisely align multiple microlens components. Alignment openings are formed in the microlens components and standard optical fibers are threaded through the openings in each microlens component as they are stacked. The fibers provide sufficient stiffness and stability to the structure to precisely align the apertures of the microlens components and thereby allow for increased assembly efficiency over traditional microlens and microcolumn bonding techniques.
Abstract:
A structure and associated method for detecting secondary and backscatter electrons in a microcolumn. A secondary electron detector and a backscatter electron detector, both located upstream of the Einzel (objective) lens in the microcolumn, provide a highly efficient axially symmetric electron detector, short column length, and short working distance. The secondary electron detector is located between the deflection system and the Einzel lens, between the suppressor plate and the Einzel lens, or between the deflection system and the beam-limiting aperture. The backscatter electron detector is located between a beam-limiting aperture and the deflection system and can be incorporated into the aperture. A secondary electron extractor placed between the sample and the Einzel lens further improves the spatial resolution caused by surface imperfection or local surface potential on the sample surface.
Abstract:
A method, an associated structure, and an apparatus for multiple charged particle beam calibration and shielded charged particle lithography. A template defining an array of membranes is positioned above a target (e.g., a semiconductor wafer of the electron beams). Each membrane defines a through slot (opening) and a set of registration marks which are located with respect to registration marks of the other membranes. Patterns are written onto the target by scanning each electron beam through its associated through slot. Intra- and inter-charged particle beam calibrations for each charged particle beam are carried out using its associated set of registration marks. The template also suppresses undesirable electrical charging of any resist present on the target during the exposure process.
Abstract:
A method for forming microcolumns in which laser spot welding bonds the multiple layers of an electron beam microcolumn. A silicon microlens is laser spot welded to a glass insulation layer by focusing a laser through the insulation layer onto the silicon microlens. The glass layer is transparent to the laser, allowing all of the energy to be absorbed by the silicon. This causes the silicon to heat, which, in turn, heats the adjacent surface of the glass insulation layer creating a micro-weld between the silicon and glass. The insulation layer includes a portion which protrudes beyond the edge of the first microlens so that when a second microlens is attached to the opposite side of the insulation layer, the second microlens can be laser spot welded to the protruding portion of the insulation layer by focusing a laser through the protruding portion of the insulation layer to heat the second microlens.
Abstract:
A method and system for cleaning the silicon microlenses in an electron-beam microcolumn in situ. The microlenses individually are heated by passing a current through each microlens. The current is utilized to heat the microlens to at least two hundred degrees Centigrade to prevent contamination and occasionally to a temperature on the order of six to seven hundred degrees Centigrade to remove any builtup or potential contamination.
Abstract:
An apparatus for surface inspection and processing of a wafer (12) includes a microcolumn (14) and an associated scanning probe microscope (16). The microcolumn enables high speed scanning of the wafer at a relatively high resolution, while the scanning probe microscope provides atomic resolution o f highly localized areas of the wafer. The microcolumn and scanning probe microscope can be partially fabricated out of the same substrate. Additionally, the microcolumn and scanning probe microscope can be a portion of an array of microcolumns and/or scanning probe microscopes. The apparatus may be used for imaging, lithography and spectroscopy.
Abstract:
A charged particle-beam microcolumn, which for example may be used for charged particle microscopy, with a T-shape configuration has a relatively narrow base structure supporting the beam forming charged particle optical column. The narrow base structure permits the T-shaped microcolumn and sample to be positioned at an angle other than normal with respect to each other, which allows generation of three-dimensional-like images of the sample surface. Thus, the incidence angle of the charged particle beam generated by the Tshaped microcolumn may be varied while a short working distance is maintained. A conventional secondary/backscattered charged particle detector may be used because the reflected angle of the charged particles allows a charged particle detector separated from the T-shaped microcolumn. Further, the small size of the T-shaped microcolumn permits observation of different parts of a large stationary sample by moving the T-shaped microcolumn with respect to the sample. Moreover, multiple T-shaped microcolumns may be arrayed to improve throughput.
Abstract:
A method and the associated apparatus for alignment and assembly of microlenses and microcolumns in which aligning structures such as rigid fibers are used to precisely align multiple microlens components. Alignment openings are formed in the microlens components and standard optical fibers are threaded through the openings in each microlens component as they are stacked. The fibers provide sufficient stiffness and stability to the structure to precisely align the apertures of the microlens components and thereby allow for increased assembly efficiency over traditional microlens and microcolumn bonding techniques.
Abstract:
An apparatus for surface inspection and processing of a wafer (12) includes a microcolumn (14) and an associated scanning probe microscope (16). The microcolumn enables high speed scanning of the wafer at a relatively high resolution, while the scanning probe microscope provides atomic resolution of highly localized areas of the wafer. The microcolumn and scanning probe microscope can be partially fabricated out of the same substrate. Additionally, the microcolumn and scanning probe microscope can be a portion of an array of microcolumns and/or scanning probe microscopes. The apparatus may be used for imaging, lithography and spectroscopy.