Lamella creation method and device using fixed-angle beam and rotating sample stage
    1.
    发明公开
    Lamella creation method and device using fixed-angle beam and rotating sample stage 审中-公开
    板条利用角度稳定的支撑成形方法和装置以及旋转样品台

    公开(公告)号:EP2674742A2

    公开(公告)日:2013-12-18

    申请号:EP13171169.9

    申请日:2013-06-10

    Applicant: FEI COMPANY

    CPC classification number: G01N1/32 H01J37/3023 H01J37/3056 H01J2237/31745

    Abstract: A method and system for creating a substantially planar face in a substrate, the method including directing one or more beams at a first surface of a substrate to remove material from a first location in the substrate, the beam being offset from a normal to the first surface by a nonzero curtaining angle; sweeping the one or more beams in a plane that is perpendicular to the first surface to mill one or more initial cuts in the substrate, the initial cuts exposing a second surface that is substantially perpendicular to the first surface; rotating the substrate through a nonzero rotation angle about an axis other than an axis that is normal to the first beam or parallel to the first beam; directing the first beam at the second surface to remove additional material from the substrate without changing the first nonzero curtaining angle; and scanning the one or more beams in a pattern across the second surface to mill one or more finishing cuts in the substrate.

    Abstract translation: 一种用于在基片创建基本上平坦的面,所述方法包括在一衬底以从衬底的第一位置移除材料的第一表面引导一个或多个波束的方法和系统中,光束被从正常偏移到所述第一 表面由一个非零垂落角; 在一个平面席卷一个或多个波束并垂直于所述第一表面到磨机中的一个或更多衬底初始切口,初始切口暴露的第二表面所做的是基本上垂直于所述第一表面上; 通过围绕轴线上以外于轴线即垂直于第一光束或平行于所述第一光束非零旋转角度旋转所述基片; 在第二表面引导所述第一光束,以除去从基板附加材料,而不改变第一个非零垂落角; 并扫描一个或多个光束在穿过所述第二表面的图案,以磨中的一个或更多衬底精加工切削。

    Improved beam positioning for beam processing
    2.
    发明公开
    Improved beam positioning for beam processing 有权
    改进光束处理的光束定位

    公开(公告)号:EP2096663A3

    公开(公告)日:2009-10-14

    申请号:EP09153259.8

    申请日:2009-02-20

    Applicant: FEI COMPANY

    Inventor: Wells, Andrew

    CPC classification number: H01J37/3045 B82Y10/00 B82Y40/00 H01J37/3056

    Abstract: An improved method and apparatus of beam processing corrects for beam drift while a beam is processing a sample. The beam position is aligned using a fiducial that is sufficiently near the working area so that the fiducial can be imaged and the sample processed without a stage moving. During processing, the beam positioning is corrected for drift using a model that predicts the drift.

    Abstract translation: 光束处理的改进方法和装置在光束正在处理样品时校正光束漂移。 使用足够靠近工作区域的基准对准光束位置,使得可以对基准进行成像并且在没有台移动的情况下处理样品。 在处理过程中,使用预测漂移的模型对波束定位进行漂移校正。

    Improved beam positioning for beam processing
    4.
    发明公开
    Improved beam positioning for beam processing 有权
    Verbesserte Strahlpositionierung zur Strahlverarbeitung

    公开(公告)号:EP2096663A2

    公开(公告)日:2009-09-02

    申请号:EP09153259.8

    申请日:2009-02-20

    Applicant: FEI COMPANY

    Inventor: Wells, Andrew

    CPC classification number: H01J37/3045 B82Y10/00 B82Y40/00 H01J37/3056

    Abstract: An improved method and apparatus of beam processing corrects for beam drift while a beam is processing a sample. The beam position is aligned using a fiducial that is sufficiently near the working area so that the fiducial can be imaged and the sample processed without a stage moving. During processing, the beam positioning is corrected for drift using a model that predicts the drift.

    Abstract translation: 一种改进的光束处理方法和装置在光束处理样品时校正光束漂移。 使用足够靠近工作区域的基准来对准光束位置,使得可以对基准进行成像,并且样品在没有阶段移动的情况下进行处理。 在处理期间,使用预测漂移的模型来校正波束定位以进行漂移。

    Lamella creation method and device using fixed-angle beam and rotating sample stage
    8.
    发明公开
    Lamella creation method and device using fixed-angle beam and rotating sample stage 审中-公开
    板条利用角度稳定的支撑成形方法和装置以及旋转样品台

    公开(公告)号:EP2674742A3

    公开(公告)日:2014-02-12

    申请号:EP13171169.9

    申请日:2013-06-10

    Applicant: FEI COMPANY

    CPC classification number: G01N1/32 H01J37/3023 H01J37/3056 H01J2237/31745

    Abstract: A method and system for creating a substantially planar face in a substrate, the method including directing one or more beams at a first surface of a substrate to remove material from a first location in the substrate, the beam being offset from a normal to the first surface by a nonzero curtaining angle; sweeping the one or more beams in a plane that is perpendicular to the first surface to mill one or more initial cuts in the substrate, the initial cuts exposing a second surface that is substantially perpendicular to the first surface; rotating the substrate through a nonzero rotation angle about an axis other than an axis that is normal to the first beam or parallel to the first beam; directing the first beam at the second surface to remove additional material from the substrate without changing the first nonzero curtaining angle; and scanning the one or more beams in a pattern across the second surface to mill one or more finishing cuts in the substrate.

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