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    HIGH-SPEED INTERCONNECTS
    1.
    发明申请
    HIGH-SPEED INTERCONNECTS 审中-公开
    高速互联

    公开(公告)号：WO2008100960A1

    公开(公告)日：2008-08-21

    申请号：PCT/US2008/053756

    申请日：2008-02-12

    Applicant: FINISAR CORPORATION ,  LEE, Yuheng ,  ZHOU, Jianying ,  ZHAO, Yan, Yang ,  COLE, Christopher, R. ,  HUEBNER, Bernd

    Inventor： LEE, Yuheng ,  ZHOU, Jianying ,  ZHAO, Yan, Yang ,  COLE, Christopher, R. ,  HUEBNER, Bernd

    IPC: H04B10/02

    CPC classification number: H01P5/028

    Abstract: In one example embodiment, a high-speed transponder includes a printed circuit board having a set of coplanar high-speed traces, and a high-speed circuit and a package mounted to the printed circuit board. The package includes an outside housing and a second high-speed circuit positioned inside the housing. The high-speed transponder also includes a high-speed feed thru which includes an inside coplanar structure positioned inside the housing, a strip line structure positioned through the housing, and an outside coplanar structure positioned outside the housing. The second high-speed circuit is operably coupled to the inside coplanar structure, which is operably coupled to the strip line structure, which is operably coupled to the outside coplanar structure, which is operably coupled to the first high-speed circuit via the set of coplanar high-speed traces. The signal plane of the outside coplanar structure is flipped with respect to a signal plane of the inside coplanar structure.

    Abstract translation: 在一个示例性实施例中，高速应答器包括具有一组共面高速迹线的印刷电路板，以及安装到印刷电路板的高速电路和封装。 该包装包括位于壳体内的外壳和第二高速电路。 高速转发器还包括高速进给器，其包括位于壳体内部的内部共面结构，通过壳体定位的带状线结构以及位于壳体外部的外部共面结构。 第二高速电路可操作地耦合到内部共面结构，其可操作地耦合到带状线结构，其可操作地耦合到外部共面结构，其可操作地耦合到第一高速电路，该组合 共面高速轨迹。 外部共面结构的信号平面相对于内部共面结构的信号平面翻转。

    PLASTIC COMPOSITE LENS ARRAY IN OPTICAL NETWORKS
    2.
    发明申请
    PLASTIC COMPOSITE LENS ARRAY IN OPTICAL NETWORKS 审中-公开

    公开(公告)号：WO2020086622A1

    公开(公告)日：2020-04-30

    申请号：PCT/US2019/057493

    申请日：2019-10-22

    Applicant: FINISAR CORPORATION

    Inventor： LING, Wenhua ,  LEE, Yuheng

    IPC: G02B6/42

    Abstract: An optoelectronic assembly may include a PCB and an optical lens. The PCB includes a top surface where at least a portion of the top surface includes a first material with a first thermal property. The optical lens includes a lens frame and an optical portion positioned within the lens frame. The lens frame is coupled to the top surface of the PCB. The lens frame includes a second material with a second thermal property, the second material being different from the first material. The optical portion positioned includes a third material with a third thermal property, the third material being different from the first material and the second material. The third material is optically transparent.

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