公开(公告)号：EP4478112A1

公开(公告)日：2024-12-18

申请号：EP23215720.6

申请日：2023-12-12

Applicant: GlobalFoundries U.S. Inc.

Inventor： RAKOWSKI, Michal ,  CHANDRAN, Sujith ,  HIROKAWA, Takako ,  GONZALEZ, Pilar

IPC: G02F1/01 ,  G02F1/025 ,  G02F1/21 ,  G02F1/225 ,  G02F1/313

Abstract: Structures for a broadband optical switch and methods of forming such structures. The structure comprises a Mach-Zehnder interferometer including first and second arms. The first arm comprises a first waveguide core, and the second arm comprises a second waveguide core. The structure further comprises a ring resonator comprising a third waveguide core that has a first thickness. A portion of the third waveguide core is adjacent to a portion of the first waveguide core over a light coupling region. A slab layer connects the portion of the first waveguide core to the portion of the third waveguide core. The slab layer has a second thickness that is less than the first thickness of the first waveguide core.

公开(公告)号：EP4468070A1

公开(公告)日：2024-11-27

申请号：EP23209945.7

申请日：2023-11-15

Applicant: GlobalFoundries U.S. Inc.

Inventor： CHANDRAN, Sujith ,  BIAN, Yusheng ,  LEE, Won Suk

IPC: G02F1/01 ,  G02F1/025

Abstract: Structures for a thermo-optic phase shifter and methods of forming a thermo-optic phase shifter. The structure comprises a semiconductor substrate, and a heater including a first resistive heating element, a second resistive heating element, and a slab layer connecting the first resistive heating element to the second resistive heating element. The first resistive heating element and the second resistive heating element have a first thickness, and the slab layer has a second thickness that is less than the first thickness. The structure further comprises a waveguide core including a portion that is laterally positioned between the first resistive heating element and the second resistive heating element. The slab layer of the heater is disposed between the portion of the waveguide core and the semiconductor substrate.

公开(公告)号：EP4550015A1

公开(公告)日：2025-05-07

申请号：EP24170916.1

申请日：2024-04-18

Applicant: GlobalFoundries U.S. Inc.

Inventor： BIAN, Yusheng ,  STRICKER, Andreas D. ,  ABOKETAF, Abdelsalam ,  HOLT, Judson R. ,  DEZFULIAN, Kevin K. ,  GIEWONT, Kenneth J. ,  DERRICKSON, Alexander ,  LEE, Won Suk ,  CHANDRAN, Sujith ,  SPORER, Ryan W. ,  LIN, Teng-Yin

IPC: G02B6/12 ,  G02B6/122

Abstract: Structures for a photonics chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector that is disposed on a substrate and that includes a light-absorbing layer. The light-absorbing layer includes a sidewall and a notch in the sidewall. The structure further comprises a waveguide core including a section adjacent to the notch in the sidewall of the light-absorbing layer.