公开(公告)号：EP4550015A1

公开(公告)日：2025-05-07

申请号：EP24170916.1

申请日：2024-04-18

Applicant: GlobalFoundries U.S. Inc.

Inventor： BIAN, Yusheng ,  STRICKER, Andreas D. ,  ABOKETAF, Abdelsalam ,  HOLT, Judson R. ,  DEZFULIAN, Kevin K. ,  GIEWONT, Kenneth J. ,  DERRICKSON, Alexander ,  LEE, Won Suk ,  CHANDRAN, Sujith ,  SPORER, Ryan W. ,  LIN, Teng-Yin

IPC: G02B6/12 ,  G02B6/122

Abstract: Structures for a photonics chip that include a photodetector and methods of forming such structures. The structure comprises a photodetector that is disposed on a substrate and that includes a light-absorbing layer. The light-absorbing layer includes a sidewall and a notch in the sidewall. The structure further comprises a waveguide core including a section adjacent to the notch in the sidewall of the light-absorbing layer.