公开(公告)号：US20040025333A1

公开(公告)日：2004-02-12

申请号：US10356464

申请日：2003-02-03

Applicant: IBIDEN Co., Ltd.

Inventor： Naohiro Hirose ,  Kouta Noda ,  Hiroshi Segawa ,  Honjin En ,  Kiyotaka Tsukada ,  Naoto Ishida ,  Kouji Asano ,  Atsushi Shouda

IPC: H05K003/36 ,  H05K003/20

CPC classification number: H05K3/4652 ,  B23K26/389 ,  H01L2224/16225 ,  H01L2924/15174 ,  H01L2924/15311 ,  H05K1/0201 ,  H05K3/0032 ,  H05K3/0035 ,  H05K3/0038 ,  H05K3/0055 ,  H05K3/0094 ,  H05K3/108 ,  H05K3/28 ,  H05K3/381 ,  H05K3/383 ,  H05K3/384 ,  H05K3/427 ,  H05K3/4602 ,  H05K3/4623 ,  H05K3/4661 ,  H05K2201/0195 ,  H05K2201/0352 ,  H05K2201/0358 ,  H05K2201/062 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/09827 ,  H05K2201/09863 ,  H05K2201/09881 ,  H05K2203/0307 ,  H05K2203/0353 ,  H05K2203/0554 ,  H05K2203/0773 ,  H05K2203/107 ,  H05K2203/121 ,  Y10T29/49117 ,  Y10T29/49124 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49165

Abstract: An opening is formed in resin 20 by a laser beam so that a via hole is formed. At this time, copper foil 22, the thickness of which is reduced (to 3 nullm) by performing etching to lower the thermal conductivity is used as a conformal mask. Therefore, an opening 20a can be formed in the resin 20 if the number of irradiation of pulse-shape laser beam is reduced. Therefore, occurrence of undercut of the resin 20 which forms an interlayer insulating resin layer can be prevented. Thus, the reliability of the connection of the via holes can be improved.

Abstract translation: 通过激光束在树脂20中形成开口，从而形成通孔。 此时，通过进行蚀刻来降低导热率的铜箔22的厚度（3μm）被用作保形掩模。 因此，如果脉冲形激光束的照射次数减少，则可以在树脂20中形成开口20a。 因此，可以防止形成层间绝缘树脂层的树脂20的底切的发生。 因此，可以提高通孔连接的可靠性。

公开(公告)号：US20010002728A1

公开(公告)日：2001-06-07

申请号：US09740424

申请日：2000-12-19

Applicant: IBIDEN CO., LTD.

Inventor： Kiyotaka Tsukada ,  Mitsuhiro Kondo ,  Kenji Chihara ,  Naoto Ishida ,  Atsushi Shouda

IPC: H01L021/44 ,  H01L021/48 ,  H01L023/52 ,  H01L021/50 ,  H01L023/48 ,  H01L029/40

CPC classification number: H05K3/3452 ,  H01L23/3171 ,  H01L2224/0401 ,  H01L2224/05571 ,  H01L2224/05572 ,  H01L2224/1148 ,  H01L2224/13021 ,  H01L2924/0002 ,  H05K3/3457 ,  H05K2201/098 ,  H05K2203/0594 ,  H01L2224/05552

Abstract: A printed circuit board 1 providing superior adhesion between a substrate 2 and a conductor pattern 3 and preventing damage of the substrate 2. The width c of the bottom surface 310 of the conductor pattern 3 is greater than the width d of the top surface 320. Accordingly, the conductor pattern 3 has a trapezoidal cross-section. The two side surfaces 315 of a lower portion 31 of the conductor pattern 3 are coated by a solder resist. The two side surfaces 325 at the upper portion 32 of the conductor pattern 3 are exposed from the solder resist 4. A solder ball 6 engages the two side surfaces 325.

Abstract translation: 一种印刷电路板1，其在基板2和导体图案3之间提供优异的粘合性并防止基板2的损坏。导体图案3的底面310的宽度c大于顶面320的宽度d。 因此，导体图案3具有梯形截面。 导体图案3的下部31的两个侧表面315被阻焊剂涂覆。 导体图案3的上部32处的两个侧表面325从阻焊剂4露出。焊球6与两个侧表面325接合。