公开(公告)号：JP2000026163A

公开(公告)日：2000-01-25

申请号：JP5559399

申请日：1999-03-03

Applicant: IBM

Inventor： DAVID LAWRENCE DANIEL ,  KNICKERBOCKER SARAH HUFFSMITH

IPC: H05K1/03 ,  C04B35/00 ,  C04B35/495 ,  C04B35/628 ,  H01L23/15

Abstract: PROBLEM TO BE SOLVED: To obtain a ceramic material having a low dielectric constant, a coefft. of thermal expansion equal to that of silicon and high mechanical strength by forming a substrate using ceramic particles coated with borosilicate glass having a specified compsn. by a sol-gel process and a binder and sintering the substrate. SOLUTION: Ceramic particles are uniformly coated with a borosilicate glass by a sol-gel process. The compsn. of the glass consists of 10-30 wt.% B2O3,

公开(公告)号：ES2073717T3

公开(公告)日：1995-08-16

申请号：ES91480057

申请日：1991-03-29

Applicant: IBM

Inventor： DAVID LAWRENCE DANIEL

IPC: C23F1/26 ,  C23F1/14 ,  C23F1/38 ,  C23F1/46

公开(公告)号：DE69110348D1

公开(公告)日：1995-07-20

申请号：DE69110348

申请日：1991-03-29

Applicant: IBM

Inventor： DAVID LAWRENCE DANIEL

IPC: C23F1/26 ,  C23F1/14 ,  C23F1/38 ,  C23F1/46

公开(公告)号：DE68908470D1

公开(公告)日：1993-09-23

申请号：DE68908470

申请日：1989-03-14

Applicant: IBM

Inventor： ANDERSON HERBERT RUDOLPH ,  BOOTH RICHARD BENTON ,  DAVID LAWRENCE DANIEL ,  NEISSER MARK OLIVER ,  SACHDEV HARBANS SINGH ,  TAKACS MARK ANTHONY

IPC: H01L23/373 ,  C09K5/08 ,  F28F13/00 ,  C09K5/00

公开(公告)号：DE3781428T2

公开(公告)日：1993-04-01

申请号：DE3781428

申请日：1987-02-11

Applicant: IBM

Inventor： DAVID LAWRENCE DANIEL

IPC: C03C3/085 ,  C03B8/02 ,  C03B19/12 ,  C03B20/00 ,  C03C3/091 ,  C03C3/097 ,  C03C10/00 ,  C03C10/08 ,  C04B35/195 ,  C04B35/626

公开(公告)号：DE69110348T2

公开(公告)日：1996-01-25

申请号：DE69110348

申请日：1991-03-29

Applicant: IBM

Inventor： DAVID LAWRENCE DANIEL

IPC: C23F1/26 ,  C23F1/14 ,  C23F1/38 ,  C23F1/46

公开(公告)号：DE68908470T2

公开(公告)日：1994-03-17

申请号：DE68908470

申请日：1989-03-14

Applicant: IBM

Inventor： ANDERSON HERBERT RUDOLPH ,  BOOTH RICHARD BENTON ,  DAVID LAWRENCE DANIEL ,  NEISSER MARK OLIVER ,  SACHDEV HARBANS SINGH ,  TAKACS MARK ANTHONY

IPC: H01L23/373 ,  C09K5/08 ,  F28F13/00 ,  C09K5/00

公开(公告)号：DE3780573D1

公开(公告)日：1992-08-27

申请号：DE3780573

申请日：1987-10-13

Applicant: IBM

Inventor： DAVID LAWRENCE DANIEL ,  ANDERSON RONALD MAURICE

IPC: C01G25/02

公开(公告)号：BR8803503A

公开(公告)日：1989-01-31

申请号：BR8803503

申请日：1988-07-12

Applicant: IBM

Inventor： DAVID LAWRENCE DANIEL

IPC: C01B21/06 ,  C01B21/064 ,  C01B21/072 ,  C01B25/08 ,  C01B35/04 ,  C07F7/02 ,  C07F7/08 ,  C07F7/10 ,  C07F9/02 ,  C07F9/68 ,  C07F9/90 ,  C22C1/00 ,  B01J37/04

公开(公告)号：DE69024263D1

公开(公告)日：1996-02-01

申请号：DE69024263

申请日：1990-03-07

Applicant: IBM

Inventor： CARR JEFFREY WILLIAM ,  DAVID LAWRENCE DANIEL ,  GUTHRIE WILLIAM LESLIE ,  KAUFMAN FRANK BENJAMIN ,  PATRICK WILLIAM JOHN ,  RODBELL KENNETH PARKER ,  PASCO ROBERT WILLIAM ,  NENADIC ANTON

IPC: C09G1/02 ,  H01L21/306 ,  H01L21/48 ,  H01L21/302

Abstract: Disclosed is a method of chem-mech polishing an electronic component substrate. The method includes the following steps; obtaining a substrate having at least two features thereon or therein which have a different etch rate with respect to a particular etchant; and contacting the substrate with a polishing pad while contacting the substrate with a slurry containing the etchant wherein the slurry includes abrasive particles, a transition metal chelated salt and a solvent for the salt. The chem-mech polishing causes the at least two features to be substantially coplanar. Also disclosed is the chem-mech polishing slurry.