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公开(公告)号:MY126479A
公开(公告)日:2006-10-31
申请号:MYPI19991382
申请日:1999-04-09
Applicant: IBM
Inventor: DANIEL CHARLES EDELSTEIN , CYPRIAN EMEKA UZOH , JAMES MCKELL EDWIN HARPER , CHAO-KUN KU , ANDREW H SIMON
IPC: H01L21/44 , H01L21/3205 , H01L23/52 , H01L21/768 , H01L23/532
Abstract: THE PRESENT INVENTION DISCLOSES AN INTERCONNECTION STRUCTURE (50) FOR PROVIDING ELECTRICAL COMMUNICATION WITH AN ELECTRONIC DEVICE (66) WHICH INCLUDES A BODY THAT IS FORMED SUBSTANTIALLY OF COPPER AND A SEED LAYER (76,78,86) OF EITHER A COPPER ALLOY OR A MTEAL THAT DOES NOT CONTAIN COPPER SANDWICH ED BETWEEN THE COPPER CONDUCTOR BODY AND THE ELECTRONIC DEVICE FOR IMPROVING THE ELETROMIGRATION RESISTANCE, THE ADHESION PROPERTY AND OTHER SURFACE PRORPERTIES OF THE INTERCONNECTION STRUCTURE. THE PRESENT INVENTION ALSO DISCLOSES, METHODS FOR FORMING AN INTERCONNECTION STRUCTURE (50) FOR PROVIDING ELECTRICAL CONNECTIONS TO AN ELECTRONIC DEVICE (66) BY FIRST DEPOSITING A SEED LAYER (76,78,86) OF COPPER ALLOY OR OTHER METAL THAT DOES NOT CONTAIN COPPER ON AN ELECTRONIC DEVICE, AND THEN FORMING A COPPER CONDUCTOR BODY ON THE SEED LAYER INTIMATELY BONDING TO THE LAYER SUCH THAT ELECTROMIGRATION RESISTANCE, ADHESION AND OTHER SURFACE PROPERTIES OF THE INTERCONNECTION STRUCTURE ARE IMPROVED.(FIG 2)
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公开(公告)号:MXPA05008066A
公开(公告)日:2005-09-21
申请号:MXPA05008066
申请日:2004-01-23
Applicant: IBM
Inventor: ANDREW H SIMON
IPC: H01L21/768
Abstract: Un dispositivo semiconductor que incluye una estructura de revestimiento mejorada formada en una via (5) que tiene porciones de paredes laterales extendidas y una parte inferior (8) que penetran el revestimiento de metal (7). La estructura de revestimiento incluye dos capas de revestimiento, estando la primera (6) sobre las paredes laterales de la via, pero no la parte inferior, y estando la segunda (9) sobre la primera capa y las porciones de paredes laterales extendidas y la parte inferior de la via. Tambien se describe un metodo para fabricar la estructura de revestimiento, en la cual la primera capa se deposita antes de una etapa de grabado quimico o de limpieza, que extiende la via hacia la linea de metal.
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公开(公告)号:GB2523948B
公开(公告)日:2017-02-22
申请号:GB201511991
申请日:2013-12-09
Applicant: IBM
Inventor: JUNJING BAO , GRISELDA BONILLA , RONALD G FILIPPI , NAFTALI E LUSTIG , ANDREW H SIMON , SAMUEL S CHOI
IPC: H01L23/532 , H01L21/768
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