公开(公告)号：DE3888608T2

公开(公告)日：1994-10-27

申请号：DE3888608

申请日：1988-08-23

Applicant: IBM

Inventor： BUCHWALTER STEPHEN LESLIE ,  KOVAC CAROLINE ANN ,  NGUYEN LUU THANH

IPC: C08G59/62 ,  C08G59/24 ,  C08G59/40 ,  C08G59/42 ,  C08G59/68 ,  C09K3/10 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31

公开(公告)号：DE3888608D1

公开(公告)日：1994-04-28

申请号：DE3888608

申请日：1988-08-23

Applicant: IBM

Inventor： BUCHWALTER STEPHEN LESLIE ,  KOVAC CAROLINE ANN ,  NGUYEN LUU THANH

IPC: C08G59/62 ,  C08G59/24 ,  C08G59/40 ,  C08G59/42 ,  C08G59/68 ,  C09K3/10 ,  H01B3/40 ,  H01L23/29 ,  H01L23/31

公开(公告)号：DE68906710D1

公开(公告)日：1993-07-01

申请号：DE68906710

申请日：1989-02-09

Applicant: IBM

Inventor： KOVAC CAROLINE ANN ,  LEDERMANN PETER GERARD ,  NGUYEN LUU THANH NGUYEN LUU TH

IPC: B29C45/14 ,  B29L31/34 ,  H01L21/56

Abstract: A method and apparatus to encapsulate a device (24) and joints (26, 28) coupled to conductive leads (30) with an encapsulating material (42). A fixture (12) has a recess to hold via a vacuum (16) the device (24) in place. Conduits in the fixture supply air (20) around the device (24) to form an air dam that flows outward around the device (24) and the leads (30). A nozzle (40) supplies a metered amount of material (42) to the surface of the device (24). By controlling the temperature of the fixture (12) and/or the air (20) forming the air dam, the flow of material can be confined to the surface of the device (24) and the joints (26, 28) as it cures. The method can also provide encapsulant edge capping to reduce device stresses.

公开(公告)号：DE3563635D1

公开(公告)日：1988-08-11

申请号：DE3563635

申请日：1985-11-05

Applicant: IBM

Inventor： BAUM THOMAS HALL ,  HOULE FRANCES ANNE ,  JONES CAROL RUTH ,  KOVAC CAROLINE ANN

IPC: C23C18/16 ,  C23C18/18 ,  C23C18/20 ,  C23C18/30 ,  C23C18/31 ,  H05K3/18

Abstract: In a method of electrolessly depositing copper on a substrate, a palladium seed pattern is formed by directing light (eg from a laser) at the substrate in the presence of the vapour of a palladium compound, such as palladium (II) bis-(hexafluoroacetylacetonate). The substrate may be first coated with a polymer which is removed by excimer laser irradiation.

公开(公告)号：DE69015878T2

公开(公告)日：1995-07-13

申请号：DE69015878

申请日：1990-03-21

Applicant: IBM

Inventor： BREGMAN MARK FIELDING ,  BUCHWALTER STEPHEN LESLIE ,  HERMANN KARL ,  KOVAC CAROLINE ANN ,  POORE PAIGE ADAMS ,  VIEHBECK ALFRED

IPC: H01L23/538 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/32 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K1/00

Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.

公开(公告)号：DE3877437T2

公开(公告)日：1993-07-15

申请号：DE3877437

申请日：1988-06-28

Applicant: IBM

Inventor： CLARKE THOMAS CARL ,  KOVAC CAROLINE ANN ,  JUNG DAE YOUNG ,  PARK JAE MYUNG ,  THOMAS RICHARD RONALD

IPC: C23C16/06 ,  C23C16/04 ,  C23C16/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  C23C18/30 ,  H01L21/288 ,  H05K3/14 ,  H05K3/18 ,  H01L21/02

公开(公告)号：BR8906690A

公开(公告)日：1990-09-11

申请号：BR8906690

申请日：1989-12-22

Applicant: IBM

Inventor： VIEHBECK ALFRED ,  BUCHWALTER STEPHEN LESLIE ,  DONSON WILLIAM ARTHUR ,  GLENNING JOHN JOSEPH ,  GOLDBERG MARTIN JOSEPH ,  GREBE KURT RUDOLPH ,  KOVAC CAROLINE ANN ,  MATTHEW LINDA CROLYN ,  PAWLOWSKI WALTER PAUL ,  SCHADT MARK JEFREY ,  SCHEUERMANN MICHAEL ROY ,  TISDALE STEPHEN LEO

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38 ,  C08F8/42 ,  C08J7/06

公开(公告)号：DE69015878D1

公开(公告)日：1995-02-23

申请号：DE69015878

申请日：1990-03-21

Applicant: IBM

Inventor： BREGMAN MARK FIELDING ,  BUCHWALTER STEPHEN LESLIE ,  HERMANN KARL ,  KOVAC CAROLINE ANN ,  POORE PAIGE ADAMS ,  VIEHBECK ALFRED

IPC: H01L23/538 ,  H05K1/02 ,  H05K1/05 ,  H05K1/14 ,  H05K3/32 ,  H05K3/42 ,  H05K3/44 ,  H05K3/46 ,  H05K1/00

Abstract: Structure for mounting electronic devices thereon. The structure is fabricated from a plurality of substrates (4, 6, 8, 10) each having a thermally and/or electrically conductive core (12) surrounded by a dielectric material (13). The substrates can be adherently placed together with the electrically conductive cores providing ground and power planes or the substrates can be mounted together with connectors (42) electrically interconnecting adjacent substrates and spacing the adjacent substrates apart providing a space through which a fluid can flow to extract heat generated by the electronic devices mounted thereon. The conductive cores provide both power and ground planes to the structure and a means for thermally dissipating the generated heat.

公开(公告)号：DE68906710T2

公开(公告)日：1993-12-23

申请号：DE68906710

申请日：1989-02-09

Applicant: IBM

Inventor： KOVAC CAROLINE ANN ,  LEDERMANN PETER GERARD ,  NGUYEN LUU THANH NGUYEN LUU TH

IPC: B29C45/14 ,  B29L31/34 ,  H01L21/56

Abstract: A method and apparatus to encapsulate a device (24) and joints (26, 28) coupled to conductive leads (30) with an encapsulating material (42). A fixture (12) has a recess to hold via a vacuum (16) the device (24) in place. Conduits in the fixture supply air (20) around the device (24) to form an air dam that flows outward around the device (24) and the leads (30). A nozzle (40) supplies a metered amount of material (42) to the surface of the device (24). By controlling the temperature of the fixture (12) and/or the air (20) forming the air dam, the flow of material can be confined to the surface of the device (24) and the joints (26, 28) as it cures. The method can also provide encapsulant edge capping to reduce device stresses.

公开(公告)号：DE3877437D1

公开(公告)日：1993-02-25

申请号：DE3877437

申请日：1988-06-28

Applicant: IBM

Inventor： CLARKE THOMAS CARL ,  KOVAC CAROLINE ANN ,  JUNG DAE YOUNG ,  PARK JAE MYUNG ,  THOMAS RICHARD RONALD

IPC: C23C16/06 ,  C23C16/04 ,  C23C16/18 ,  C23C18/16 ,  C23C18/20 ,  C23C18/28 ,  C23C18/30 ,  H01L21/288 ,  H05K3/14 ,  H05K3/18 ,  H01L21/02