公开(公告)号：DE3866659D1

公开(公告)日：1992-01-16

申请号：DE3866659

申请日：1988-09-05

Applicant: IBM

Inventor： BAUSMITH ROBERT CROWELL ,  COTE WILLIAM JOSEPH ,  CRONIN JOHN EDWARD ,  HOLLAND KAREY LYNN ,  KAANTA CARTER WELLING ,  LEE PEI-ING PAUL ,  WRIGHT TERRANCE MONTE

IPC: C23F4/00 ,  H01L21/3213 ,  H01L21/31

公开(公告)号：DE3572564D1

公开(公告)日：1989-09-28

申请号：DE3572564

申请日：1985-12-13

Applicant: IBM

Inventor： ABRAMS ALLAN DAVID ,  BAUSMITH ROBERT CROWELL ,  HOLLAND KAREY LYNN ,  HOLLAND STEVEN PAUL

IPC: H01L21/302 ,  H01L21/3065 ,  H01L21/311 ,  H01L21/312

Abstract: A method of selectively tailoring the slope of via hole sidewalls of insulating layers of integrated circuits. A first insulator layer (12) (in which the vias are to be formed) is covered by a removable layer (14), and the two layers are isotropically etched. By varying the thickness of the removable layer (14) with respect to that of the insulator layer (12), the slope of the via hole sidewalls can be controlled.