公开(公告)号：US3668025A

公开(公告)日：1972-06-06

申请号：US3668025D

申请日：1971-05-06

Applicant: IBM

Inventor： BLUM JOSEPH M ,  HOEKSTRA JAN P

IPC: H01L21/00 ,  H01L21/24 ,  H01L23/29 ,  H01L23/485 ,  H01L7/46

CPC classification number: H01L23/293 ,  H01L21/00 ,  H01L21/24 ,  H01L23/485 ,  H01L2924/0002 ,  H01L2924/00

Abstract: THE INVENTION INVOLVES A PROCESS FOR ALLOYING A METAL SUCH AS ALUMINUM INTO A SEMICONDUCTOR SUCH AS GERMANIUM IN THE PRESENCE OF REACTIVE INSULATING MATERIAL SUCH AS SILICON DIOXIDE. A LAYER OF AN ORGANIC MATERIAL IS DEPOSITED ON THE SURFACE OF THE INSULATING MATERIAL PRIOR TO ALLOYING AND HEATED FOR A TIME AND TEMPERATURE SUFFICIENT TO LEAVE A RESIDUE OF THE ORGANIC MATERIAL AT THE SURFACE OF THE INSULATING MATERIAL. THE ORGANIC MATERIAL IS REMOVED BY SPRAYING WITH AN ORGANIC SOLVENT SUCH AS TRICHLORO-ETHYLENE WHILE THE MATERIALS ARE STILL HOT. ALLOYING OF THE METAL WITH THE SEMICONDUCTOR IS THEN CARRIED OUT AND ANY REACTION BETWEEN THE ALUMINUM AND THE SILICON DIOXIDE WHICH MIGHT BE EXPECTED TO OCCUR IS MINIMIZED.

公开(公告)号：CA974632A

公开(公告)日：1975-09-16

申请号：CA150317

申请日：1972-08-28

Applicant: IBM

Inventor： BLUM JOSEPH M ,  SHIH KWANG K

IPC: H01L33/00 ,  C30B19/06 ,  C30B19/10 ,  H01L27/15

公开(公告)号：DE69010298T2

公开(公告)日：1995-01-26

申请号：DE69010298

申请日：1990-07-26

Applicant: IBM

Inventor： BLUM JOSEPH M ,  CHAN KEVIN K ,  MCINTOSH ROBERT C ,  WEINBERG ZEEV A

IPC: C23C16/02 ,  C23C16/40 ,  H01L21/316 ,  H01L21/285

公开(公告)号：DE69010298D1

公开(公告)日：1994-08-04

申请号：DE69010298

申请日：1990-07-26

Applicant: IBM

Inventor： BLUM JOSEPH M ,  CHAN KEVIN K ,  MCINTOSH ROBERT C ,  WEINBERG ZEEV A

IPC: C23C16/02 ,  C23C16/40 ,  H01L21/316 ,  H01L21/285