Abstract:
A method of evaluating process effects of multiple exposure photolithographic processes by first determining a set of expected images for each exposure step or process of the multiple exposure process individually (SET1, SET2) and then obtaining a composite set of images (FINALSET) by sequentially perturbing images from a first or previous exposure step (SET1) by weighted images from the subsequent exposure step (SET2). Preferably, the expected images are determined by simulation in the form of normalized aerial images over a range of defocus for each exposure step, and the weighting factor used is the dose-ratio of the subsequent exposure dose to the prior step exposure dose. The resulting composite set of images may be used to evaluate multiple exposure processes, for example, to provide an estimate of yield for a given budget of dose and focus errors, or alternatively, to provide specifications for tool error budgets required to obtain a target yield.
Abstract:
A method for exposing a workpiece in a dual exposure step-and-repeat process starts by forming a design for a reticle mask. Deconstruct the design for the reticle mask by removing a set(s) of the features that are juxtaposed to form hollow polygonally-shaped clusters with a gap in the center. Form unexposed resist on the workpiece. Load the workpiece and the reticle mask into the stepper. Expose the workpiece through the reticle mask. Reposition the workpiece by a nanostep. Then expose the workpiece through the reticle mask after the repositioning. Test whether the plural exposure process is finished. If the result of the test is NO the process loops back to repeat some of the above steps. Otherwise the process has been completed. An overlay mark is produced by plural exposures of a single mark. A dead zone is provided surrounding an array region in which printing occurs subsequent to exposure in an original exposure. Alternatively, the workpiece can be fully exposed first by stepping a series of full steps, then going back to the starting position, making a nanostep to reset the starting position and re-exposing from the reset starting position in the same way with full steps from the nanostepped position. The clusters may be in the shape of a hexagon or a diamond.
Abstract:
PROBLEM TO BE SOLVED: To provide a method and an apparatus for generating a mask pattern for alternating phase-shift mask lithography. SOLUTION: The method for generating patterns of a pair of photomasks from a data set defining a circuit layout to be realized on a substrate includes identifying critical segments of the circuit layout to be realized on the substrate. Block mask patterns are generated and then legalized based on the identified critical segments. Thereafter, phase mask patterns are generated, legalized and colored. The legalized block mask patterns and the legalized phase mask patterns that have been colored define features of a block mask and an alternating phase shift mask, respectively, for use in a dual exposure method for patterning features in a resist layer of the substrate. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide an E beam system for storing calibration data and using a hyper-parallel array of electron sources assembled by an integrated circuit technology as well as a system for each beam to control individual beams, by using the calibration data. SOLUTION: The E beam system stores the calibration data by using a flash EPROM and generates one set of super-parallel beams with a scale of 1,000 beams by receiving on/off signals directed by an address system of a memory array with each electron source mounted on the memory array as a geometrical array to trace a memory array structure. COPYRIGHT: (C)2004,JPO&NCIPI