公开(公告)号：DE3463949D1

公开(公告)日：1987-07-02

申请号：DE3463949

申请日：1984-09-21

Applicant: IBM

Inventor： BUPP JAMES R ,  LEMON GARY KEVIN ,  MARKOVICH VOYA ,  SAMBUCETTI CARLOS J ,  TISDALE STEPHEN L ,  TREVITT DONNA J

IPC: H05K3/18 ,  C23C18/28 ,  H05K3/38 ,  C23C18/24 ,  C23C18/38

公开(公告)号：CA1191745A

公开(公告)日：1985-08-13

申请号：CA428750

申请日：1983-05-24

Applicant: IBM

Inventor： BUPP JAMES R ,  MARKOVICH VOYA ,  NAPP TRACY E ,  SAMBUCETTI CARLOS J

IPC: H05K3/18 ,  C23C18/18 ,  C23C18/20 ,  C23C18/30 ,  H05K3/38

Abstract: CONDITIONING OF A SUBSTRATE FOR ELECTROLESS DIRECT BOND PLATING IN HOLES AND ON SURFACES OF A SUBSTRATE A dielectric surface is conditioned for electroless plating of a conductive metal thereon by contacting the surface with a multifunctional ionic copolymer. The conditioning can be in the holes and/or on the surfaces of the substrate. The copolymer material contains at least two ionic moieties of a charge opposite from the charge associated with catalyst particles to be subsequently applied prior to the deposition of the conductive metal.