公开(公告)号：DE3463949D1

公开(公告)日：1987-07-02

申请号：DE3463949

申请日：1984-09-21

Applicant: IBM

Inventor： BUPP JAMES R ,  LEMON GARY KEVIN ,  MARKOVICH VOYA ,  SAMBUCETTI CARLOS J ,  TISDALE STEPHEN L ,  TREVITT DONNA J

IPC: H05K3/18 ,  C23C18/28 ,  H05K3/38 ,  C23C18/24 ,  C23C18/38

公开(公告)号：DE3668474D1

公开(公告)日：1990-03-01

申请号：DE3668474

申请日：1986-08-14

Applicant: IBM

Inventor： AMELIO WILLIAM J ,  MARKOVICH VOYA ,  SAMBUCETTI CARLOS J ,  TREVITT DONNA J

IPC: C23C18/31 ,  C23C18/16 ,  G01N27/26 ,  G01N27/48 ,  C23C18/40 ,  C25F3/02

Abstract: A process for monitoring an electroless plating bath (1) to determine whether it is in a take mode, by electrolessly depositing a film of the metal of the plating bath onto a substrate to provide a preplated cathode (5); providing the cathode (5), a reference electrode (4), and an anode (6) in the electroless bath; passing an electric current and varying the voltage difference, plotting the voltage difference versus the current; and comparing the oxidation peak of the reducing agent to the oxidation peak of the reduced state of the metal ion to be plated, to thereby determine whether the bath (1) is in a take mode.