Abstract:
THEN A PLATINUM AND CALOMEL ELECTRODE, COUPLED VIA AN ELECTROLYTE SOLUTION, ACT TO CAUSE GALVANIC COULOMETRIC REDUCTION OF THE IODINE TO REGENERATE IODIDE. AT STEADY STATE THE ONLY CURRENT-REGULATING MECHANISM IS THE DIFFUSION OF GLUCOSE ACROSS THE MEMBRANE, WHICH IS A LINEAR FUNCTION OF CONCENTRATION.
A MEASURING SYSTEM IS PROVIDED WHICH DIRECTLY MEASURES THE CONCENTRATION OF GLUCOSE IN BIOLOGICAL FLUIDS. GLUCOSE FROM A BIOLOGICAL FLUID IS DIFFUSED THROUGH A SEMIPERMEABLE MEMBRANE INTO A REACTION CHAMBER AND IS CATALYZED BY THE ENZYME GLUCOSE OXIDASE WHEREUPON GLUCONIC ACID AND HYDROGEN PEROXIDE ARE FORMED. IODIDE IONS IN THE REACTION CHAMBER THEN EFFECT THE DECOMPOSITION OF THE HYDROGEN PEROXIDE TO FORM IODINE AND WATER.
Abstract:
A DIFFERENTIAL ION SENSITIVE MEASURING SYSTEM IS PROVIDED TO MEASURE THE CONCENTRATION OF PARTICULAR CONSTITUENTS OF A FLUID. A PAIR OF IDENTICAL ION SENSITIVE ELECTRODES OR PROBES ARE USED TO PROVIDE THE DIFFERENTIAL MEASUREMENT. ONE OF THE ELECTRODES IN SURROUNDED WITH A REGENT SELECTED TO REACT WITH THE MOLECULES OF THE FLUID CONSTITUENT UNDER TEST. UPON CONTACT WITH THE FLUID TO BE ANALYZED EACH ELECTRODE RESPONDS IN THE SAME MANNER TO IONS IN THE FLUID SO AS TO YIELD A ZERO VOLTAGE DIFFERENCE FROM THE EFFECTS THEREOF. HOWEVER, AT THE ELECTRODE SURROUNDED WITH THE REAGENT THE LATTER REACTS WITH MOLECULES OF THE CONSTITUENTS UNDER TEST TO PRODUCE AN ION CHANGE THEREAT NOT SEEN BY THE OTHER ELECTRODE. THE MAGNITUDE OF THE ION CHANGE IS INDICATIVE OF THE CONCENTRATION OF THE CONSTITUENT UNDER TEST.
Abstract:
A HIGH IMPEDANCE VOLTMETER IS COUPLED ON ONE SIDE TO A STANDARD REFERENCE ELECTRODE AND ON THE OTHER SIDE TO A PH SENSITIVE URANIUM OXIDE (U308) ELECTRODE. THE LOW ELECTRICAL IMPEDANCE URANIUM OXIDE ELECTRODE COMPRISES A NOBLE METAL WIRE COATED WITH A THIN SMOOTH LAYER OF URANIUM OXIDE.
Abstract:
THE SILVER CHLORIDE LAYER OF A SILVER-SILVER CHLORIDE ELECTRODE IS COATED WITH A THIN PROTECTIVE LAYER OF METHACRYLATE. THE LAYER OF METHACRYLATE ACTS TO PREVENT CORROSION OF THE SLIVER CHLORIDE LAYER AND YET ALLOWS SAME TO REATAIN ITS ION SENSITIVITY.
Abstract:
Circuit boards are manufactured by forming a substrate with a dielectric surface and laminating a metal foil onto the substrate. The metal foil is patterned to form a first wiring layer. A permanent photoimagable dielectric layer is formed over the wiring layer and via holes are formed through the dielectric layer over pads and conductors of the wiring layer. Holes are formed through the substrate and substrate surfaces including the photoimagable dielectric, walls of the via holes, and walls of the through holes subjected to an electroless copper plating process. The process includes seeding the surface, coating the surface with a first solution containing surfactant and electroplating in a second solution in which the level of surfactant is regulated by determining the surface tension and metering surfactant addition to the second solution depending on the determination of surface tension. The copper plating on the photoimagable dielectric is patterned to form an exterior wiring layer which is covered by solder resist with windows over lands around the through holes and surface mount connection pads of the exterior wiring layer to form a high density circuitized substrate. Surface mount components and/or pin in hole components are attached to the circuitized substrate with solder joints between terminals of the components and the lands and/or connection pads to form a high density circuit board assembly. One or more of the circuit board assemblies are mounted in an enclosure with a power supply, CPU, RAM, and I/O means to form an information handling system with increased performance due to shorter signal flight times due to the higher device density.
Abstract:
A method for preparing a copper pad surface for electrical connection that has superior diffusion barrier and adhesion properties is provided. In the method, a copper pad surface is first provided that has been cleaned by an acid solution, a protection layer of a phosphorus or boron-containing metal alloy is then deposited on the copper pad surface, and then an adhesion layer of a noble metal is deposited on top of the protection layer. The protection layer may be a single layer, or two or more layers intimately joined together formed of a phosphorus or boron-containing metal alloy such as Ni-P, Co-P, Co-W-P, Co-Sn-P, Ni-W-P, Co-B, Ni-B, Co-Sn-B, Co-W-B and Ni-W-B to a thickness between about 1,000 Å and about 10,000 Å. The adhesion layer can be formed of a noble metal such as Au, Pt, Pd and Ag to a thickness between about 500 Å and about 4,000 Å.
Abstract:
1417223 Recording medium INTERNATIONAL BUSINESS MACHINES CORP 6 July 1973 [28 July 1972] 32438/73 Heading D2B [Also in Division G1] An electrolytic recording medium for use with apparatus to provide for marks to be selectively recorded on the medium either permanently or erasably (see Division Gl) comprises a porous medium, e.g. paper, impregnated with a conductive salt such as potassium fluoride, ammonium fluoride, or ammonium oxalate a reducing agent for reducing metal ions released in the medium, such as ascorbic acid stannous chloride or stannous sulphate, and an electrochromic material such as a pH indicator or a Redox system. An electrochromic material is defined as one the electromagnetic radiation absorbtion characteristics of which may be selectively altered by the influence of an electric field.
Abstract:
Improvements in water based magnetic inks of the type containing non-ionic, cationic and/or anionic surfactants by the inclusion of glycerol, non-volatile solvent such as mono-lower alkyl ethers of ethylene glycol and low molecular weight polyethylene diols.