公开(公告)号：SG97159A1

公开(公告)日：2003-07-18

申请号：SG200004133

申请日：2000-07-24

Applicant: IBM

Inventor： STEPHAN A COHEN ,  CLAUDIUS FEGER ,  JEFFREY CURTIS HEDRICK ,  JANE MARGARET SHAW

IPC: H01L21/28 ,  H01L21/312 ,  H01L21/20 ,  H01L21/314 ,  H01L23/532 ,  H01L29/51 ,  H01L23/58 ,  H01L23/48

Abstract: An interlayer dielectric for preventing Cu ion migration in semiconductor structure containing a Cu region is provided. The interlayer dielectric of the present invention comprises a dielectric material that has a dielectric constant of 3.0 or less and an additive which is highly-capable of binding Cu ions, yet is soluble in the dielectric material. The presence of the additive in the low k dielectric allows for the elimination of conventional inorganic barrier materials such as SiO2 or Si3N4.

公开(公告)号：GB2547753A

公开(公告)日：2017-08-30

申请号：GB201621803

申请日：2016-12-21

Applicant: IBM

Inventor： JAIONE TIRAPU AZPIROZ ,  MATHIAS STEINER ,  RICARDO LUIS OHTA ,  CLAUDIUS FEGER ,  YUKSEL TEMIZ ,  EMMANUEL DELAMARCHE

IPC: B01L9/00 ,  B01L3/00

Abstract: An assembly for interfacing with a microfluidic chip 238 having at least one microscopic channel with at least one embedded electrode configured to receive a liquid sample for analysis and at least one chip contact coupled to the electrode, the assembly comprising a chip carrier 240, an electronics module 110, an optical module 118 and a mechanical module. The chip carrier includes a base and a cover which define a cavity 236 for receiving the chip, and at least one chip carrier contact 234 to engage with the chip contact. The electronics module comprises at least one electronic module contact 248 which engage with the chip carrier contacts and a signal generator which applies at least one electrokinetic signal to the embedded electrode(s) of the chip via the electronic module contacts. The optical module includes an excitation radiation source and an emission radiation detector. The mechanical module is controlled by the electronics module and comprises a chip-carrier receiving structure, relatable with respect to the optical module for focus and at least one degree of translational freedom. The embedded electrodes are ideally dielectrophoresis electrodes. A method of carrying out a test on a microfluidic chip employing impedance changes is also disclosed.

公开(公告)号：GB2546180A

公开(公告)日：2017-07-12

申请号：GB201701192

申请日：2015-09-02

Applicant: IBM

Inventor： LIOR HORESH ,  MARIA JOAO BRITO MOURA ,  CLAUDIUS FEGER ,  ULISSES MELLO

IPC: G01V99/00

Abstract: Conventional computational simulation and inversion of subsurface flow are expensive, which is wasteful in terms of time and energy consumption. A process for implementation of mathematical techniques such as forward simulation, sensitivity analysis, and inversion to physical microstructure models for subsurface fluid simulation is disclosed. This process not only offers accurate and reliable results, but also is cost effective.

公开(公告)号：GB2546180B

公开(公告)日：2020-12-09

申请号：GB201701192

申请日：2015-09-02

Applicant: IBM

Inventor： LIOR HORESH ,  MARIA JOAO BRITO MOURA ,  CLAUDIUS FEGER ,  ULISSES MELLO

IPC: G01V99/00

公开(公告)号：GB2547753B

公开(公告)日：2020-07-08

申请号：GB201621803

申请日：2016-12-21

Applicant: IBM

Inventor： JAIONE TIRAPU AZPIROZ ,  MATHIAS STEINER ,  RICARDO LUIS OHTA ,  CLAUDIUS FEGER ,  YUKSEL TEMIZ ,  EMMANUEL DELAMARCHE

IPC: G01N27/447