公开(公告)号：MY121455A

公开(公告)日：2006-01-28

申请号：MYPI20005562

申请日：2000-11-28

Applicant: IBM

Inventor： WALTON ERICK GREGORY ,  UZOH CYPRIAN EMEKA ,  CHUNG DEAN S ,  COLLINS LARA SANDRA ,  CORBIN WILLIAM E ,  DELIGIANNI HARIKLIA ,  EDELSTEIN DANIEL CHARLES ,  FLUEGEL JAMES E ,  KOREJWA JOSEF WARREN ,  LOCKE PETER S

IPC: C25D5/22 ,  C25D5/06 ,  C25D17/00 ,  C25D17/14

Abstract: AA METAL PLATING APPARATUS IS DESCRIBED WHICH INCLUDES A COMPRESSIBLE MEMBER HAVING A CONDUCTIVE SURFACE COVERING SUBSTANTIALLY ALL OF THE SURFACE OF THE SUBSTRATE TO BE PLATED. THE PLATING CURRENT IS THEREBY TRANSMITTED OVER A WIDE AREA OF THE SUBSTRATE, RATHER THAN A FEW LOCALIZED CONTACT POINTS. THE COMPRESSIBLE MEMBER IS POROUS SO AS TO ABSORB THE PLATING SOLUTION AND TRANSMIT THE PLATING SOLUTION TO THE SUBSTRATE. THE WAFER AND COMPRESSIBLE MEMBER MAY ROTATE WITH RESPECT TO EACH OTHER. THE COMPRESSIBLE MEMBER MAY BE AT CATHODE POTENTIAL OR MAY BE A PASSIVE CIRCUIT ELEMENT.