中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

12 records (took 0.016 seconds)

    RADIO FREQUENCY CIRCUIT AND MEMORY IN THIN FLEXIBLE PACKAGE
    2.
    发明专利
    RADIO FREQUENCY CIRCUIT AND MEMORY IN THIN FLEXIBLE PACKAGE 未知

    公开(公告)号：HUT76996A

    公开(公告)日：1998-01-28

    申请号：HU9700407

    申请日：1995-08-08

    Applicant: IBM

    Inventor： BRADY MICHAEL JOHN ,  COTEUS PAUL WILLIAM ,  MOSKOWITZ PAUL ANDREW

    IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59

    Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

    3.
    发明专利
    未知

    公开(公告)号：AT179270T

    公开(公告)日：1999-05-15

    申请号：AT95929818

    申请日：1995-08-08

    Applicant: IBM

    Inventor： BRADY MICHAEL JOHN ,  MOSKOWITZ PAUL ANDREW ,  COTEUS PAUL WILLIAM

    IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59

    Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

    Radio frequency circuit and memory in thin flexible package
    6.
    发明专利
    Radio frequency circuit and memory in thin flexible package 未知

    公开(公告)号：SG46938A1

    公开(公告)日：1998-03-20

    申请号：SG1995000278

    申请日：1995-04-18

    Applicant: IBM

    Inventor： BRADY MICHAEL JOHN ,  MOSKOWITZ PAUL ANDREW ,  COTEUS PAUL WILLIAM

    IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59 ,  H01Q23/00

    Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

    RADIO FREQUENCY CIRCUIT AND MEMORY IN A THIN FLEXIBLE UNIT
    7.
    发明专利
    RADIO FREQUENCY CIRCUIT AND MEMORY IN A THIN FLEXIBLE UNIT 未知

    公开(公告)号：PL318977A1

    公开(公告)日：1997-07-21

    申请号：PL31897795

    申请日：1995-08-08

    Applicant: IBM

    Inventor： BRADY MICHAEL JOHN ,  MOSKOWITZ PAUL ANDREW ,  COTEUS PAUL WILLIAM

    IPC: G08B13/24 ,  G06K19/077 ,  H01L23/66 ,  H04B1/59

    Abstract: The present invention is a novel thin and flexible radio frequency (RF) tag that comprises a semiconductor circuit that has logic, memory, and radio frequency circuits, connected to an antenna with all interconnections placed on a single plane of wiring without crossovers. The elements of the package (substrate, antenna, and laminated covers) are flexible. The elements of the package are all thin. The tag is thin and flexible, enabling a unique range of applications including: RF ID tagging of credit cards, passports, admission tickets, and postage stamps.

    8.
    发明专利
    未知

    公开(公告)号：DE69308390D1

    公开(公告)日：1997-04-10

    申请号：DE69308390

    申请日：1993-06-07

    Applicant: IBM

    Inventor： CIPOLLA THOMAS MARIO ,  COTEUS PAUL WILLIAM ,  DAMIANAKIS IOANNIS ,  JOHNSON GLEN WALDEN ,  MATTHEW LINDA CAROLYN ,  MOK LAWRENCE SHUNGWEI ,  LEDERMANN PETER GERARD

    IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

    Abstract: This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cube structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contains solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate surface or the pin-like structures can be adapted for insertion into apertures in a second substrate. The second substrate provides a means for electrically interconnecting a plurality of these cubes. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cube.

    PAD ON PAD TYPE CONTACT INTERCONNECTION TECHNOLOGY FOR ELECTRONIC APPARATUS
    9.
    发明专利
    PAD ON PAD TYPE CONTACT INTERCONNECTION TECHNOLOGY FOR ELECTRONIC APPARATUS 未知

    公开(公告)号：MY116360A

    公开(公告)日：2004-01-31

    申请号：MYPI9501967

    申请日：1995-07-12

    Applicant: IBM

    Inventor： COTEUS PAUL WILLIAM ,  LANZETTA ALPHONSO PHILIP

    IPC: H01R4/48 ,  H01L23/48 ,  H01R12/52 ,  H01R13/24 ,  H05K3/36

    Abstract: A PAD ON PAD TYPE CONTACT (14, 15), AND TECHNOLOGY THEREFOR, FOR ELECTRONIC APPARATUS WHEREIN A SPRING MEMBER (1, 10, 41-46), THAT BY ITS SHAPE AND MATERIAL, IN THE MOTION WHEN THE CONTACT COMES TOGETHER WIPES THE MATING PAD SURFACES (16, 17) ACROSS EACH OTHER AND THEN RETAINS THEM UNDER PERMANENT COMPRESSIVE FORCE IN SERVICE. IN HIGH DENSITY AND HIGH PERFORMANCE ELECTRONIC APPARATUS INTERWIRING, ARRAY QUANTITIES OF THE SPRING MEMBER OF CONTACT ARE FABRICATED IN UNITARY ASSEMBLY ELEMENTS FOR CONNECTION ASSEMBLIES BETWEEN BOTH RIGID AND FLEXIBLE TYPE WIRING.

Patent Agency Ranking