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    1.
    发明专利
    未知

    公开(公告)号：DE69308390D1

    公开(公告)日：1997-04-10

    申请号：DE69308390

    申请日：1993-06-07

    Applicant: IBM

    Inventor： CIPOLLA THOMAS MARIO ,  COTEUS PAUL WILLIAM ,  DAMIANAKIS IOANNIS ,  JOHNSON GLEN WALDEN ,  MATTHEW LINDA CAROLYN ,  MOK LAWRENCE SHUNGWEI ,  LEDERMANN PETER GERARD

    IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

    Abstract: This invention relates to three dimensional packaging of integrated circuit chips into stacks to form cube structures. Between adjacent chips in the stack, there is disposed an electrical interconnection means which is a first substrate having a plurality of conductors one end of which is electrically connected to chip contact locations and the other end of which extends to one side of the chip stack to form a plurality of pin-like electrical interconnection assemblies. The pin-like structures can be formed from projections of the first substrate having an electrical conductor on at least one side thereof extending from this side. Alternatively, the pin-like structures can be formed from conductors which cantilever from both sides of an edge of the first substrate corresponding conductors from both sides are aligned and spaced apart by the first substrate thickness. The spaces contains solder and form solder loaded pin-like structures. The pin-like structures can be directly solder bonded to conductors on a second substrate surface or the pin-like structures can be adapted for insertion into apertures in a second substrate. The second substrate provides a means for electrically interconnecting a plurality of these cubes. Preferably, the first and second substrates are circuitized flexible polymeric films. The second substrate is disposed on a third substrate, such as a PC board, with a resilient material therebetween which permits a heat sink to be pressed into intimate contact with an opposite side of the cube.

    2.
    发明专利
    未知

    公开(公告)号：DE68901573D1

    公开(公告)日：1992-06-25

    申请号：DE68901573

    申请日：1989-03-16

    Applicant: IBM

    Inventor： LEDERMANN PETER GERARD ,  NGUYEN LUU THANH

    IPC: B23K3/06 ,  H05K3/34

    Abstract: A tool employing a solder foot (20) to deposit solder on a series of conductive surfaces (21, 22) as the tool moves. In one embodiment, non-wettable blade (18) attached to the tool breaks the film. A pair of sensors (15) coupled to a control circuit monitor the position of the solder foot and the position may be changed as a function of the operation to be performed, i.e. deposit, reflow, standby while tool is moved. In a second embodiment a discrete solder mass is extruded and deposited on a preheated pad. In a third embodiment, solder wire is delivered to an omnidirectional tool for deposition.

    7.
    发明专利
    未知

    公开(公告)号：DE68906710T2

    公开(公告)日：1993-12-23

    申请号：DE68906710

    申请日：1989-02-09

    Applicant: IBM

    Inventor： KOVAC CAROLINE ANN ,  LEDERMANN PETER GERARD ,  NGUYEN LUU THANH NGUYEN LUU TH

    IPC: B29C45/14 ,  B29L31/34 ,  H01L21/56

    Abstract: A method and apparatus to encapsulate a device (24) and joints (26, 28) coupled to conductive leads (30) with an encapsulating material (42). A fixture (12) has a recess to hold via a vacuum (16) the device (24) in place. Conduits in the fixture supply air (20) around the device (24) to form an air dam that flows outward around the device (24) and the leads (30). A nozzle (40) supplies a metered amount of material (42) to the surface of the device (24). By controlling the temperature of the fixture (12) and/or the air (20) forming the air dam, the flow of material can be confined to the surface of the device (24) and the joints (26, 28) as it cures. The method can also provide encapsulant edge capping to reduce device stresses.

    9.
    发明专利
    未知

    公开(公告)号：DE68906710D1

    公开(公告)日：1993-07-01

    申请号：DE68906710

    申请日：1989-02-09

    Applicant: IBM

    Inventor： KOVAC CAROLINE ANN ,  LEDERMANN PETER GERARD ,  NGUYEN LUU THANH NGUYEN LUU TH

    IPC: B29C45/14 ,  B29L31/34 ,  H01L21/56

    Abstract: A method and apparatus to encapsulate a device (24) and joints (26, 28) coupled to conductive leads (30) with an encapsulating material (42). A fixture (12) has a recess to hold via a vacuum (16) the device (24) in place. Conduits in the fixture supply air (20) around the device (24) to form an air dam that flows outward around the device (24) and the leads (30). A nozzle (40) supplies a metered amount of material (42) to the surface of the device (24). By controlling the temperature of the fixture (12) and/or the air (20) forming the air dam, the flow of material can be confined to the surface of the device (24) and the joints (26, 28) as it cures. The method can also provide encapsulant edge capping to reduce device stresses.

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