Abstract:
This specification discloses a storage cell which employs a single dual emitter silicon-controlled rectifying device as a storage element. This silicon-controlled rectifier device is biased to have two stable-operating states and is addressed by a word line connected to one of its emitters and a bit line connected to the other of its emitters. A transistor is formed by these two emitters and the gating layer of the silicon-controlled rectifier. By application of half select pulses to the word and bit lines this transistor is broken down so as to cause current to flow in the gating region or layer of the silicon-controlled rectifier. When current flows in the gating region the operating characteristic of the silicon-controlled rectifier changes so that the silicon-controlled rectifier switches from a highvoltage, low-current stable state to a low-voltage, high-current stable state along the operating curve of the silicon-controlled rectifier. To increase the turnoff speed of the silicon-controlled rectifier a Schottky Barrier diode is connected between the gating layer and the other intermediate layer of the siliconcontrolled rectifying device to discharge charge stored in the junction between the two layers.
Abstract:
This application discloses a storage cell which employs a single gated multi-emitter semiconductor device that exhibits a negative resistance operating characteristic. The semiconductor device is biased to have two stable operating states on this negative resistance characteristic and is addressed by a word line connected to one of its emitters and a bit line connected to the other of its emitters. A parasitic transistor is formed by the two emitters and the gating layer of the semiconductor device. By application of half-select pulses to the word and bit lines, the parasitic transistor is broken down to cause a temporary current flow in the gating region of the semiconductor device. While this current flows in the gating region, the operating characteristic of the semiconductor device is changed so that there is only one stable operating state for the semiconductor device. The operation of the semiconductor device therefore shifts to this single operating state. When the temporary current flow ends the semiconductor device will be in a low voltage, high current stable state along the negative resistance characteristic irrespective of the operating state of the semiconductor device prior to the application of the half select pulses. When such a storage cell is manufactured in monolithic form, very high cell densities and extremely high operating speeds are obtainable.
Abstract:
1367058 Capacitive memory cells INTERNATIONAL BUSINESS MACHINES CORP 1 Feb 1973 [20 March 1972] 5028/73 Heading H3T A capacitor data storage cell CS is refreshed during a read operation by a latch circuit 9. Data is read from CS by a F.E.T. Q1 in response to a low voltage on the word line 4. If a high level (1) is stored, a transistor 7 conducts to raise the bit line 5, and this triggers the latch 9 which is an SCR in Fig. 1. The latch acts to raise the voltage on line 5 above that which was necessary to initiate triggering, and this raised voltage is fed through another transistor 6 to refresh the storage cell CS. The capacitance of the line 5 is discharged by a transistor 12 which is turned on at the beginning of a read operation, but turned off before the word line 4 voltage is lowered to effect reading. Transistors 12 and Q1 are turned on together, however, if it is desired to write a "0" (i.e. CS is earthed). To write a "1" a further transistor 13 is turned on to raise bit line 5 to +V while word line 4 turns on Q1. Instead of the SCR 9, an emitter coupled pair (16, 17, Fig. 2, not shown) with a positive feedback emitter follower 20, may be used; this has to be reset by a transistor inverter 25. The collector load in the emitter coupled pair may be either a resistor, or (Fig. 3, not shown) a F.E.T. (31) with a gate-source capacitor which is precharged by a further F.E.T. 29 and which boosts conduction of the load F.E.T. (31). The load F.E.T. (31) is fed with a pulsed power supply which is high during a read (refresh) operation, but goes low thereafter and resets the latch by way of the feedback transistor (30).
Abstract:
A test system having improved means for reducing driver switching (delta I) noise. The test system employs a tester connected to and electrically testing an integrated circuit device, such as a logic chip. The integrated circuit device has a plurality of input terminals (R5-R54) for receiving an electrical test pattern from the tester. The integrated circuit device also includes a plurality of output driver circuits (D2-D1O2) having outputs connected to the tester. The test system is characterized in that said integrated circuit device includes a driver sequencing circuit (L1-L1O) responsive to at least one control signal (R1-R4) from said tester to sequentially condition said driver circuits for possible switching, whereby delta I noise is reduced during testing.
Abstract:
A test system having improved means for reducing driver switching (delta I) noise. The test system employs a tester connected to and electrically testing an integrated circuit device, such as a logic chip. The integrated circuit device has a plurality of input terminals (R5-R54) for receiving an electrical test pattern from the tester. The integrated circuit device also includes a plurality of output driver circuits (D2-D1O2) having outputs connected to the tester. The test system is characterized in that said integrated circuit device includes a driver sequencing circuit (L1-L1O) responsive to at least one control signal (R1-R4) from said tester to sequentially condition said driver circuits for possible switching, whereby delta I noise is reduced during testing.