公开(公告)号：JPH04356937A

公开(公告)日：1992-12-10

申请号：JP3667091

申请日：1991-02-07

Applicant: IBM

Inventor： UIRIAMU DEIIN BURUUA ,  KURUTO RUDORUFU GUREEBE ,  REIMONDO ROBAATO HOOTON ,  RINDA KARORIN MASHIYUU ,  IZUMEERU SEBUDETO NOIYAN ,  MAIKERU JIYON PAAMAA ,  SANPASU PURUSHIYOTAMAN ,  DEBITSUDO RII RASU

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

Abstract: PURPOSE: To provide a composition and coating for preventing the generation of electrolytic migration between tape automated bonding(TAB) package leads. CONSTITUTION: A nickel alloy protection coating 15 is applied to an alloy composition or a copper-made current carrying lead 13 containing copper/nickel. Consequently the formation of a dendrite between TAB package leads can be prevented.