公开(公告)号：JPH0661606A

公开(公告)日：1994-03-04

申请号：JP11746793

申请日：1993-05-19

Applicant: IBM

Inventor： TOMASU MARIO SAIPOORA ,  POORU UIRIAMU KOTEUSU ,  IOANISU DAMIANAKISU ,  GUREN UORUDEN JIYONSON ,  PIITAA JIERARUDO REDAAMAN ,  RINDA KARORIN MASHIYUU ,  ROORENSU SHIYANGUUEI MOTSUKU

IPC: H01L25/18 ,  H01L25/065 ,  H01L25/07 ,  H05K1/14 ,  H05K1/18 ,  H05K3/32 ,  H05K3/34 ,  H05K3/36 ,  H05K3/40

Abstract: PURPOSE: To form a cubic structure by laminating integrated circuit chips to make a three-dimensional packaging. CONSTITUTION: A first substrate 14 to which a chip 11 is mounted has conductors, one end of each conductor is electrically connected to a chip contact 206 and the other end forms pin-like electric connection mounts 444. The pin-like structure may be formed by a protrusion of the first substrate 14 having the conductors extending to the surface, or otherwise formed as a structure having parts extending like a cantilever from both faces of the end of the first substrate and solder charged in the space therebetween. The pin-like structure may be soldered directly to the conductors on the surface of a second substrate 21 or inserted and coupled in a hole of this substrate.

公开(公告)号：JPH02190475A

公开(公告)日：1990-07-26

申请号：JP30229589

申请日：1989-11-22

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOZEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：JPH07173637A

公开(公告)日：1995-07-11

申请号：JP24634794

申请日：1994-10-12

Applicant: IBM

Inventor： HARII RANDORU BITSUKUFUOODO ,  PIITAA JIEIMUZU DEYUUKU ,  ERIZABESU FUOSUTAA ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  BOYA RISUTA MARUKOBITSUKU ,  RINDA KARORIN MASHIYUU ,  DONARUDO JIIN MAKUBURAIDO ,  TERENSU ROBAATO OTOUURU ,  SUTEIIBUN RIIOU TEISUDEIRU ,  ARUFURETSUDO BIIBETSUKU

IPC: C08J3/24 ,  C23C18/20 ,  C23C18/28 ,  C25D5/56 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

公开(公告)号：JPH06322547A

公开(公告)日：1994-11-22

申请号：JP21022593

申请日：1993-08-25

Applicant: IBM

Inventor： ARUFURETSUDO BIIBETSUKU ,  SUTEIIBUN RESURII BUTSUKUUOORU ,  UIRIAMU AASAA DONSON ,  JIYON JIYOSEFU GURENINGU ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  KUATO RUUDORUFU GURIIBU ,  KARORAIN AN KOBATSUKU ,  RINDA KARORIN MASHIYUU ,  UOORUTAA POORU PAUROUSUKII ,  MAAKU JIEFURII SHIYATSUTO ,  MAIKURU ROI SHIYOIAAMAN ,  SUTEIIBUN RIIOU TEISUDEIRU

IPC: C23C18/20 ,  C08J5/12 ,  C08J7/00 ,  C23C18/16 ,  C23C18/28 ,  H05K3/38

公开(公告)号：JPH0641763A

公开(公告)日：1994-02-15

申请号：JP16230391

申请日：1991-06-07

Applicant: IBM

Inventor： HARII RANDORU BITSUKUFUOODO ,  PIITAA JIEIMUZU DEYUUKU ,  ERIZABESU FUOSUTAA ,  MAATEIN JIYOZEFU GOORUDOBAAGU ,  BOYA RISUTA MARUKOBITSUKU ,  RINDA KARORIN MASHIYUU ,  DONARUDO JIIN MAKUBURAIDO ,  TERENSU ROBAATO OTOUURU ,  SUTEIIBUN RIIOU TEISUDEIRU ,  ARUFURETSUDO BIIBETSUKU

IPC: C08J3/24 ,  C23C18/20 ,  C23C18/28 ,  C25D5/56 ,  H05K1/03 ,  H05K3/18 ,  H05K3/38 ,  H05K3/42

公开(公告)号：JPH04356937A

公开(公告)日：1992-12-10

申请号：JP3667091

申请日：1991-02-07

Applicant: IBM

Inventor： UIRIAMU DEIIN BURUUA ,  KURUTO RUDORUFU GUREEBE ,  REIMONDO ROBAATO HOOTON ,  RINDA KARORIN MASHIYUU ,  IZUMEERU SEBUDETO NOIYAN ,  MAIKERU JIYON PAAMAA ,  SANPASU PURUSHIYOTAMAN ,  DEBITSUDO RII RASU

IPC: H01L21/60 ,  H01L21/48 ,  H01L23/498 ,  H01L23/50 ,  H05K1/00 ,  H05K1/09 ,  H05K3/24

Abstract: PURPOSE: To provide a composition and coating for preventing the generation of electrolytic migration between tape automated bonding(TAB) package leads. CONSTITUTION: A nickel alloy protection coating 15 is applied to an alloy composition or a copper-made current carrying lead 13 containing copper/nickel. Consequently the formation of a dendrite between TAB package leads can be prevented.