CHEMICAL VAPOR DEPOSITION REACTOR

    公开(公告)号:JPH07193016A

    公开(公告)日:1995-07-28

    申请号:JP26428094

    申请日:1994-10-27

    Applicant: IBM

    Abstract: PURPOSE: To improve the thickness and uniformity of the characteristics of a deposited film. CONSTITUTION: A CVD has a nozzle 52 and equalizing means 54 for equalizing the chemical reaction and the flow of reaction material. The nozzle 52, which introduces reaction vapor into a chamber 15, is provided opposite to a susceptor 14 which holds a substrate in the chamber upon film formation by chemical deposition from the reaction vapor to the surface of the substrate. The nozzle 52 has an inlet port 58 for receiving the reaction vapor from a vapor-supply side, and an outlet port 60 for passing and discharging the reaction vapor. The equalizing means 54 is characterized by a plate 62 having a shape determined depending on the profile of the flow of the reaction material in the chamber. The equalizing means 54 acts to uniformize chemical reaction on the surface of the substrate and the flow of the reaction material, by using the shape of the plate 62.

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