Apparatus for detecting defects by optical scanning
    1.
    发明授权
    Apparatus for detecting defects by optical scanning 失效
    通过光学扫描检测缺陷的装置

    公开(公告)号:US3645626A

    公开(公告)日:1972-02-29

    申请号:US3645626D

    申请日:1970-06-15

    Applicant: IBM

    CPC classification number: G03F7/70483 G01B11/02 G01N21/956

    Abstract: Apparatus for detecting defects in optically discernible patterns on substrates. In apparatus which compares the optically discernible patterns in a pair of regions by coincidentally scanning said regions with a pair of optical sensing members in order to detect differences in the coincidentally sensed data, there is provided a control pattern and a third optical sensing means for scanning the control pattern along a path coincident with the scan paths of the first two sensing means. The control pattern contains optical indicia. When the third sensing means senses one of these optical indicia it activates means which interrupts the comparison of the data sensed by the pair of sensing means.

    Abstract translation: 用于检测基板上光学可辨别图案中的缺陷的装置。 在通过用一对光学感测构件巧妙地扫描所述区域来比较一对区域中的光学可辨别图案以便检测重合感测数据的差异的装置中,提供了一种控制模式和用于扫描的第三光学感测装置 沿着与第一两个感测装置的扫描路径一致的路径的控制图案。 控制图案包含光学标记。 当第三感测装置感测到这些光标记中的一个时,它启动中断由一对感测装置感测的数据的比较的装置。

    Mask overlay checking means
    3.
    发明授权
    Mask overlay checking means 失效
    掩护检查手段

    公开(公告)号:US3674487A

    公开(公告)日:1972-07-04

    申请号:US3674487D

    申请日:1970-06-18

    Applicant: IBM

    CPC classification number: G03F7/70633 G03F7/70616 H01L21/00 Y10S430/153

    Abstract: A METHOD FOR COMPARING THE PATTERN IN A PAIR OF LIGHT MASKS, E.G., MASKS HAVING REGIONS TRANSPARENT TO LIGHT AND REGIONS OPAQUE TO LIGHT. A LIGHT MASKING COPY, EITHER POSITIVE OR NEGATIVE, OF EACH OF THE MASKS IS MADE. THE OPAQUE REGION IN ONE OF SAID COPIES IS RENDERED SEMITRANSPARENT, AFTER WHICH A LIGHT SENSITIVE SUBSTRATE IS EXPOSED THROUGH BOTH OF SAID COPIES SUPERIMPOSED IN REGISTRATION WITH EACH OTHER TO PRODUCE A THREE-TONE COMPOSITE IMAGE IN THE LIGHT SENSITIVE SUBSTRATE OF THE PAIR OF MASKS IN REGISTRATION. WHERE ONE OF THE MASKS HAS SMALLER REGIONS WHICH SHOULD BE POSITIONED WITHIN LIMITS OF LARGER REGIONS ON THE OTHER MASK WHEN SAID MASKS ARE USED IN REGISTRATION WITH EACH OTHER, THE TYPE OF COPY, EITHER POSITIVE OR NEGATIVE, MADE OF EACH MASK AS WELL AS THE SELECTION OF THE MASK IN WHICH THE OPAQUE REGIONS ARE RENDERED SEMITRANSPARENT IS GOVERNED BY THE THE REQUIREMENT THAT SAID SMALLER REGIONS IN SAID COPIES ARE AT LEAST AS OPAQUE AS SAID LARGER REGIONS.

    4.
    发明专利
    未知

    公开(公告)号:FR2324548A1

    公开(公告)日:1977-04-15

    申请号:FR7614185

    申请日:1976-05-06

    Applicant: IBM

    Abstract: A portable carrier for a semiconductor wafer is detachably connected to an air slide so that the wafer can be propelled from the carrier to the air slide and vice versa by air from the air slide. The carrier has a chamber with an air slide base on which the wafer is supported by air from the air slide when the wafer is to be propelled into or out of the chamber. The carrier has a single wafer port, which is sealed except when the carrier is connected to the air slide, through which the wafer enters or exits when propelled by air from the air slide. When the carrier chamber is sealed, the wafer is retained in position within the chamber by retaining means, which are rendered ineffective when the wafer is to be propelled into or out of the chamber.

    5.
    发明专利
    未知

    公开(公告)号:DE3576634D1

    公开(公告)日:1990-04-19

    申请号:DE3576634

    申请日:1985-12-13

    Applicant: IBM

    Abstract: @ The disclosure is directed to a method and a tool for the replacement of any single connector pin (1) contained within a sizeable array of closely spaced very small connector pins on an electronic packaging structure (2) (substrate or module) without causing deleterious effects either to the remaining pins (1) or the substrate, which may be ceramic.A pin gripper mechanism (10,11,12) is accurately positioned over the connector pin (1) to be replaced, the pin (1) is grasped with a pulling force (16) being applied. A stream of heated gas (8) is directed by a nozzle (7) onto the lower portion of the connector pin (1) which can be removed when the temperature reaches the reflow temperature of the alloy at the brazing joint. A replacement pin (1) is then inserted under pressure, with the heated gas (6,8) brazing the pin (1) in position.

    AUTOMATED INTEGRATED CIRCUIT MANUFACTURING SYSTEM

    公开(公告)号:CA1058329A

    公开(公告)日:1979-07-10

    申请号:CA272816

    申请日:1977-02-28

    Applicant: IBM

    Abstract: AUTOMATED INTEGRATED CIRCUIT MANUFACTURING SYSTEM A computer controlled manufacturing system for fabricating semiconductor wafers into large scale integrated circuit devices and wherein each semiconductor wafer has scored, or recorded thereon, distinct identifying indicia, such as a machine readable serial number. A plurality of concurrently operable semiconductor wafer processing stations are independently computer controlled. Each of the stations performing at least one discrete fabrication step. A digital computer system operable under stored program control means, said computer system being interconnected with and controlling said processing stations, random access storage means, reading means and conveying means, whereby under computer control selected ones of said semiconductor wafers which are randomly stored in said random access storage means may be selected and fabricated into first part number large scale integrated circuit devices, and selected second ones of said semiconductor wafers randomly stored in said random access storage means may be selected and fabricated into second part number large scale integrated circuit devices, where said first and second part number devices are not identical.

    WAFER POCKET FOR RECEPTION AND DISPENSING CONNECTION TO PNEUMATIC CONVEYERS

    公开(公告)号:CA1036191A

    公开(公告)日:1978-08-08

    申请号:CA255047

    申请日:1976-06-16

    Applicant: IBM

    Abstract: A portable carrier for a semiconductor wafer is detachably connected to an air slide so that the wafer can be propelled from the carrier to the air slide and vice versa by air from the air slide. The carrier has a chamber with an air slide base on which the wafer is supported by air from the air slide when the wafer is to be propelled into or out of the chamber. The carrier has a single wafer port, which is sealed except when the carrier is connected to the air slide, through which the wafer enters or exits when propelled by air from the air slide. When the carrier chamber is sealed, the wafer is retained in position within the chamber by retaining means, which are rendered ineffective when the wafer is to be propelled into or out of the chamber.

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