公开(公告)号：JP2001093895A

公开(公告)日：2001-04-06

申请号：JP2000244146

申请日：2000-08-11

Applicant: IBM

Inventor： BARBEE STEVEN G ,  RICHARD ANTHONY CONTEY ,  KOSTENKO ALEXANDER ,  SARMA NARAYANA V ,  WILSON DONALD L ,  WONG JUSTIN WAI-CHOW ,  ZUHOSKI STEVEN P

IPC: C23C16/40 ,  C23C16/46 ,  C23C16/52 ,  H01L21/205 ,  H01L21/31

Abstract: PROBLEM TO BE SOLVED: To provide adhering treatment for forming a high quality aluminum oxide film by using low-pressure chemical vapor deposition(LPCVD) on a silicon substrate or an equivalent substrate by temperature controlling a steam transfer system during chemical vapor deposition of aluminum oxide. SOLUTION: A device in a chemical vapor deposition(CVD) system monitors the temperature of an actual wafer/substrate 10 during adhering treatment, and forms a high quality aluminum oxide film under real-time wafer/substrate control. In this case, source steam for LPCVD adhering aluminum oxide to a silicon substrate is repeatedly supplied exactly. This device is provided with a heated source substance, a heated transfer passage, heated inert gas discharge passages 21a-21c, pressure difference large flow rate controllers 24 and 28, a control system having a related valve, and a vacuum treatment chamber having a wall which is to be temperature-controlled as a complete source transfer system.

公开(公告)号：DE3576634D1

公开(公告)日：1990-04-19

申请号：DE3576634

申请日：1985-12-13

Applicant: IBM

Inventor： DRUSCHEL WILLIAM O ,  KOSTENKO ALEXANDER ,  MEINERT ROLF GERD

IPC: H01L23/50 ,  B23K1/012 ,  B23K1/018 ,  H01R43/02 ,  H05K13/04 ,  B23K1/00

Abstract: @ The disclosure is directed to a method and a tool for the replacement of any single connector pin (1) contained within a sizeable array of closely spaced very small connector pins on an electronic packaging structure (2) (substrate or module) without causing deleterious effects either to the remaining pins (1) or the substrate, which may be ceramic.A pin gripper mechanism (10,11,12) is accurately positioned over the connector pin (1) to be replaced, the pin (1) is grasped with a pulling force (16) being applied. A stream of heated gas (8) is directed by a nozzle (7) onto the lower portion of the connector pin (1) which can be removed when the temperature reaches the reflow temperature of the alloy at the brazing joint. A replacement pin (1) is then inserted under pressure, with the heated gas (6,8) brazing the pin (1) in position.