公开(公告)号：AT528796T

公开(公告)日：2011-10-15

申请号：AT08718206

申请日：2008-03-26

Applicant: IBM

Inventor： BUCHWALTER STEPHEN ,  FURMAN BRUCE ,  GRUBER PETER ,  NAH JAE-WOONG ,  SHIH DA-YUAN

IPC: H01L23/00

Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.