公开(公告)号：GB2491739A

公开(公告)日：2012-12-12

申请号：GB201214867

申请日：2011-01-19

Applicant: IBM

Inventor： GRUBER PETER ,  LAURO PAUL A ,  NAH JAE-WOONG

IPC: H01L21/48 ,  H01L23/498 ,  H05K3/34

Abstract: A substrate comprising a plurality of wet-able pads formed on a surface of the substrate; and a solder resist layer deposited on the surface of the substrate is obtained. At least the solder resist layer is formed with recessed regions defining volumes adjacent the wet-able pads. Molten solder is directly injected into the volumes adjacent the wet-able pads, such that the volumes adjacent the wet-able pads are filled with solder and the solder solidifies forming a plurality of solder structures adhered to the wet-able pads. The substrate and the solder are re-heated after the solidification, to re-flow the solder into generally spherical balls extending above the outer surface of the solder resist layer. In an alternative approach, solder injection and solidification are carried out in a nitrogen environment or a forming gas environment, and the reflow step may be omitted.

公开(公告)号：GB2491739B

公开(公告)日：2014-09-03

申请号：GB201214867

申请日：2011-01-19

Applicant: IBM

Inventor： GRUBER PETER ,  LAURO PAUL A ,  NAH JAE-WOONG

IPC: H01L21/48

公开(公告)号：AT528796T

公开(公告)日：2011-10-15

申请号：AT08718206

申请日：2008-03-26

Applicant: IBM

Inventor： BUCHWALTER STEPHEN ,  FURMAN BRUCE ,  GRUBER PETER ,  NAH JAE-WOONG ,  SHIH DA-YUAN

IPC: H01L23/00

Abstract: An electrical interconnect forming method. The electrical interconnect includes a first substrate comprising a first electrically conductive pad, a second substrate comprising a second electrically conductive pad, and an interconnect structure electrically and mechanically connecting the first electrically conductive pad to the second electrically conductive pad. The interconnect structure comprises a non-solder metallic core structure, a first solder structure, and a second solder structure. The first solder structure electrically and mechanically connects a first portion of the non-solder metallic core structure to the first electrically conductive pad. The second solder structure electrically and mechanically connects a second portion of the non-solder metallic core structure to the second electrically conductive pad.