公开(公告)号：AT445034T

公开(公告)日：2009-10-15

申请号：AT03783387

申请日：2003-11-14

Applicant: IBM

Inventor： ECONOMIKOS LAERTIS ,  DELIGIANNI HARIKLIA ,  COTTE JOHN ,  GRABARZ HENRY ,  CHEN BOMY

IPC: C25D5/22 ,  C25D5/48 ,  C25D7/12 ,  C25D17/00 ,  H01L21/288 ,  H01L21/321 ,  H01L21/768

Abstract: A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching.