公开(公告)号：EP1560949A4

公开(公告)日：2007-02-28

申请号：EP03783387

申请日：2003-11-14

Applicant: IBM

Inventor： ECONOMIKOS LAERTIS ,  DELIGIANNI HARIKLIA ,  COTTE JOHN M ,  GRABARZ HENRY J ,  CHEN BOMY

IPC: C25D5/48 ,  C25D7/12 ,  H01L21/288 ,  H01L21/321 ,  H01L21/768 ,  C25D5/22 ,  C25D17/00

CPC classification number: C25D7/123 ,  C25D5/48 ,  C25D17/001 ,  H01L21/2885 ,  H01L21/3212 ,  H01L21/32125 ,  H01L21/7684 ,  Y10S205/917

Abstract: A method and apparatus are described for performing both electroplating of a metal layer and CMP planarization of the layer on a substrate. The apparatus includes a table (10) supporting a polishing pad (20); the table and pad have a plurality of holes (210, 220) forming channels for dispensing an electroplating solution onto the pad. Electroplating anodes (201, 202, 203) are disposed in the channels and in contact with the electroplating solution. A carrier (12) holds the substrate (1) substantially parallel to the top surface of the pad (20) and applies variable mechanical force on the substrate against the pad, so that the spacing between substrate and pad may be less during electroplating than during electroetching.

公开(公告)号：AU2003290804A1

公开(公告)日：2004-06-15

申请号：AU2003290804

申请日：2003-11-14

Applicant: IBM

Inventor： ECONOMIKOS LAERTIS ,  DELIGIANNI HARIKLIA ,  COTTE JOHN M ,  GRABARZ HENRY J ,  CHEN BOMY

IPC: C25D5/48 ,  C25D7/12 ,  H01L21/288 ,  H01L21/321 ,  H01L21/768 ,  C25D5/22 ,  C25D17/00

Abstract: A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching.

公开(公告)号：DE60329621D1

公开(公告)日：2009-11-19

申请号：DE60329621

申请日：2003-11-14

Applicant: IBM

Inventor： ECONOMIKOS LAERTIS ,  DELIGIANNI HARIKLIA ,  COTTE JOHN M ,  GRABARZ HENRY J ,  CHEN BOMY

IPC: C25D5/22 ,  C25D5/48 ,  C25D7/12 ,  C25D17/00 ,  H01L21/288 ,  H01L21/321 ,  H01L21/768

Abstract: A method and apparatus are described for performing both electroplating of a metal layer and planarization of the layer on a substrate. Electroplating and electroetching of metal (such as copper) are performed in a repeated sequence, followed by chemical-mechanical polishing. An electroplating solution, electroetching solution, and a non-abrasive slurry are dispensed on a polishing pad in the respective process steps. The substrate is held against the pad with a variable force in accordance with the process, so that the spacing between substrate and pad may be less during electroplating than during electroetching.