公开(公告)号：DE68912275T2

公开(公告)日：1994-06-30

申请号：DE68912275

申请日：1989-09-04

Applicant: IBM

Inventor： ALBRECHTA STANLEY MICHAEL ,  BURNS FRANCIS CHARLES ,  CARDEN GARY RICHARD ,  CHEN WILLIAM TZE-YOU ,  GRESKO ANDREW RICHARD ,  SKARVINKO EUGENE PETER ,  KAUFMAN JOHN JULIAN ,  TONSI NADIA

IPC: H01B7/08 ,  H01B13/00 ,  H01R27/00 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/38

Abstract: A flexible supporting cable for an electronic device which includes a steel foil substrate (1), a layer of polymer (2) on portions of the substrate, circuit pads (3) on the polymer layer having both the bottom and top surfaces of the pads exposed; circuit lines (5) extending from the top surface of the pads, a window (6) free from steel beneath a portion of the circuit lines (5), and a second, smaller window (7) free from both steel and the polymer beneath a portion of the circuit lines (5). Methods are provided for fabricating these flexible supporting cables.

公开(公告)号：DE68912275D1

公开(公告)日：1994-02-24

申请号：DE68912275

申请日：1989-09-04

Applicant: IBM

Inventor： ALBRECHTA STANLEY MICHAEL ,  BURNS FRANCIS CHARLES ,  CARDEN GARY RICHARD ,  CHEN WILLIAM TZE-YOU ,  GRESKO ANDREW RICHARD ,  SKARVINKO EUGENE PETER ,  KAUFMAN JOHN JULIAN ,  TONSI NADIA

IPC: H01B7/08 ,  H01B13/00 ,  H01R27/00 ,  H05K1/05 ,  H05K1/11 ,  H05K3/00 ,  H05K3/38

Abstract: A flexible supporting cable for an electronic device which includes a steel foil substrate (1), a layer of polymer (2) on portions of the substrate, circuit pads (3) on the polymer layer having both the bottom and top surfaces of the pads exposed; circuit lines (5) extending from the top surface of the pads, a window (6) free from steel beneath a portion of the circuit lines (5), and a second, smaller window (7) free from both steel and the polymer beneath a portion of the circuit lines (5). Methods are provided for fabricating these flexible supporting cables.