公开(公告)号：GB2402100B

公开(公告)日：2005-01-19

申请号：GB0417609

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: B29C45/14 ,  G02B6/42 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

公开(公告)号：GB2370012B

公开(公告)日：2004-11-03

申请号：GB0110833

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

Abstract: Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

公开(公告)号：GB2402100A

公开(公告)日：2004-12-01

申请号：GB0417609

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: B29C45/14 ,  G02B6/42 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biased to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould (92, Fig 13) is positioned over the base, and resin is then injected into the mould cavity through an inlet comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second subassembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive.

公开(公告)号：GB2370012A

公开(公告)日：2002-06-19

申请号：GB0110833

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biassed to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould 92 is positioned over the base, and resin is then injected into the mould cavity through an inlet passage 97 and a gate 98. The overmould 18 is part of an optoelectronic transceiver module comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second sub-assembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive. Leads from the sub-assembly 36 are then secured to pads 60,61 in a cavity 58 in the overmould.