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    ALIGNMENT SYSTEM FOR SUBASSEMBLY OF OVERMOLDED PHOTOELECTRIC MODULE
    3.
    发明专利
    ALIGNMENT SYSTEM FOR SUBASSEMBLY OF OVERMOLDED PHOTOELECTRIC MODULE 失效

    公开(公告)号：JP2002043342A

    公开(公告)日：2002-02-08

    申请号：JP2001137796

    申请日：2001-05-08

    Applicant: IBM

    Inventor： CHAN BENSON ,  FORTIER PAUL FRANCIS ,  FRANCOIS M GINDON ,  JOHNSON GLEN WALDEN ,  MARSHALL A RUTOONEOO ,  SHERMAN JOHN H ,  REALE TETORAATO

    IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28

    Abstract: PROBLEM TO BE SOLVED: To provide a method by which positioning of a laminate substrate or other substrates on a mold base is improved. SOLUTION: This alignment system of a photoelectric module has an overmolded chip carrier 26 and positions a substrate in a mold precisely to form an overmold frame 18 on the substrate. Co-operating stand-off pads 70, 71, 72 in a retainer assembly on the overmold frame stabilize an assembly of these components, and provide precise gaps to bond these two components permanently. The retainer assembly 36 has a co-operating feature for positioning an end electric lead of a flexible circuit in an electric pad array on the substrate. A nearby electric lead is protected by a permanent enclosing plate on a nearby edge portion of the flexible circuit and positioned by optic dies and an electric pad on their carriers.

    Alignment systems for subassemblies of overmolded optoelectronic modules
    7.
    发明专利
    Alignment systems for subassemblies of overmolded optoelectronic modules 未知

    公开(公告)号：GB2370012B

    公开(公告)日：2004-11-03

    申请号：GB0110833

    申请日：2001-05-03

    Applicant: IBM

    Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

    IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

    Abstract: Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

    Alignment arrangement for moulding overmoulds for optoelectronic modules
    8.
    发明专利
    Alignment arrangement for moulding overmoulds for optoelectronic modules 未知

    公开(公告)号：GB2402100A

    公开(公告)日：2004-12-01

    申请号：GB0417609

    申请日：2001-05-03

    Applicant: IBM

    Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

    IPC: B29C45/14 ,  G02B6/42 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

    Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biased to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould (92, Fig 13) is positioned over the base, and resin is then injected into the mould cavity through an inlet comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second subassembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive.

    Alignment arrangement for moulding overmoulds, e.g. for optoelectronic modules
    9.
    发明专利
    Alignment arrangement for moulding overmoulds, e.g. for optoelectronic modules 未知

    公开(公告)号：GB2370012A

    公开(公告)日：2002-06-19

    申请号：GB0110833

    申请日：2001-05-03

    Applicant: IBM

    Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

    IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

    Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biassed to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould 92 is positioned over the base, and resin is then injected into the mould cavity through an inlet passage 97 and a gate 98. The overmould 18 is part of an optoelectronic transceiver module comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second sub-assembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive. Leads from the sub-assembly 36 are then secured to pads 60,61 in a cavity 58 in the overmould.

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