公开(公告)号：CA2180807A1

公开(公告)日：1998-01-10

申请号：CA2180807

申请日：1996-07-09

Applicant: IBM CANADA

Inventor： BOUTIN LYNDA ,  LETOURNEAU MARTIAL A ,  TETREAULT REAL

IPC: B29C45/26 ,  B29C45/02 ,  B29C70/70 ,  B29L31/34 ,  H01L21/56 ,  H01L23/02 ,  H01L23/12 ,  H01L23/24 ,  H01L23/29 ,  H01L23/50

Abstract: A method and resulting integrated circuit package is disclosed for encapsula tingintegrated circuit chips using transfer molding tech niques in a form known as cavity packages. Each chip is positioned within a cavity surrounded by a laminate or printed wiring board which provides an array of contacts. The contacts provide for connections to an external circuit card and the contact s are also indirectly connected internally to the chip. The cavity, chip and some of the laminate, contacts and interconnections are on the same side of the carr ier.Liquid plastic is forced into the cavity via a runne r in a mold through a gate in the bottom of the carrier in order to encapsulate all of these components .

公开(公告)号：GB2370012B

公开(公告)日：2004-11-03

申请号：GB0110833

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

Abstract: Alignment systems for optoelectronic modules with overmolded chip carriers include drilled or milled substrate corners for engaging dowel pins to precisely align the substrate in a mold for molding an overmold frame on the substrate. The overmold frame includes slot and trilobe holes for receiving retainer posts to precisely align a retainer assembly on the overmold frame. Cooperating standoff pads on the overmold frame and on the retainer assembly stabilize the assembly of these components and provide a precise gap for receiving an adhesive to permanently attach these two components. The retainer assembly carries optoelectronic components that include a flexible circuit, and a distal end portion of this flexible circuit and walls of a receiving cavity in the overmold frame have cooperating features for precisely aligning distal electrical leads of the flexible circuit with an array of electrical pads on the substrate. A permanent shroud on a proximate end portion of the flexible circuit protects and helps align proximate electrical leads with electrical pads on optic dies and their carriers.

公开(公告)号：GB2402100B

公开(公告)日：2005-01-19

申请号：GB0417609

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: B29C45/14 ,  G02B6/42 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

公开(公告)号：CA2350747A1

公开(公告)日：2002-12-15

申请号：CA2350747

申请日：2001-06-15

Applicant: IBM CANADA

Inventor： PAQUET MARIE-CLAUDE ,  TETREAULT REAL ,  BOYAUD MARIE-FRANCE ,  DUFORT CATHERINE

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/34

Abstract: Improvements in providing integrated circuit packages using transfer molding by encapsulating and underfilling integrated circuit chips attached to substrates are described. According to the invention there is provided method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly consisting of an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portio n wherein the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means applies a clamping force to the first and the second portio ns of the mold to clamp the substrate between the first and second portions with the integrate d circuit chip located in the first cavity. Vent means exhausts air from the first cavity. Means for injecting encapsulant into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel to the first cavity, such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the seco nd cavity to thereby underfill and encapsulate the integrated circuit assembly.

公开(公告)号：CA2350747C

公开(公告)日：2005-08-16

申请号：CA2350747

申请日：2001-06-15

Applicant: IBM CANADA

Inventor： BOYAUD MARIE-FRANCE ,  PAQUET MARIE-CLAUDE ,  DUFORT CATHERINE ,  TETREAULT REAL

IPC: H01L21/56 ,  H01L23/31 ,  H01L23/34

Abstract: Improvements in providing integrated circuit packages using transfer molding by encapsulating and underfilling integrated circuit chips attached to substrates are described. According to the invention there is provided method, mold and apparatus for encapsulating and underfilling an integrated circuit chip assembly consisting of an integrated circuit chip mounted on a substrate in a standoff relationship. The mold has a first portion and a second portio n wherein the first portion having first and second cavities and at least one channel interconnecting said first and second cavities. The first cavity is adapted to enclose said integrated circuit chip on said substrate. Means applies a clamping force to the first and the second portio ns of the mold to clamp the substrate between the first and second portions with the integrate d circuit chip located in the first cavity. Vent means exhausts air from the first cavity. Means for injecting encapsulant into the first cavity of the first portion at a location in the first portion remote from the point of connection of the channel to the first cavity, such that encapsulant flows around and underneath the integrated circuit chip and through the channel into the seco nd cavity to thereby underfill and encapsulate the integrated circuit assembly.

公开(公告)号：GB2402100A

公开(公告)日：2004-12-01

申请号：GB0417609

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: B29C45/14 ,  G02B6/42 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biased to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould (92, Fig 13) is positioned over the base, and resin is then injected into the mould cavity through an inlet comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second subassembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive.

公开(公告)号：GB2370012A

公开(公告)日：2002-06-19

申请号：GB0110833

申请日：2001-05-03

Applicant: IBM

Inventor： CHAN BENSON ,  FORTIER PAUL F ,  GUINDON FRANCOIS M ,  JOHNSON GLEN W ,  LETOURNEAU MARTIAL A ,  SHERMAN JOHN H ,  TETREAULT REAL

IPC: H01L21/56 ,  B29C45/14 ,  G02B6/42 ,  H01L23/28 ,  H01L23/31 ,  H01L25/16 ,  H05K7/02 ,  H05K13/00

Abstract: To mould an overmould 18 onto the surface of a substrate 19, the substrate is provided with two concave recesses 86 which interengage with pins 88 upstanding from the base 80 of a mould. The radius of curvature of the recesses 86 is greater than the radius of curvature of the pins 88 so that the recesses engage with the pins along a line of contact which allows accurate alignment of the substrate with the base of the mould. The recesses are biassed to engage with the pins by the action of a tapered surface 89 of a plunger 90 as a top mould 92 is positioned over the base, and resin is then injected into the mould cavity through an inlet passage 97 and a gate 98. The overmould 18 is part of an optoelectronic transceiver module comprising a first sub-assembly 26 of electrical components on the substrate 19 and an optoelectronic receiver 20 and transmitter 22 mounted as a second sub-assembly 36 which engages with the overmould. The second sub-assembly has two pins which are a press fit respectively in a moulded slot hole 43 having two opposing sides and a moulded trilobe hole 44 having three sidewalls in a platform 38 of the overmould to locate the second sub-assembly accurately. The sub-assemblies 26, 36 are subsequently secured together by adhesive. Leads from the sub-assembly 36 are then secured to pads 60,61 in a cavity 58 in the overmould.