公开(公告)号：DE69124411T2

公开(公告)日：1997-07-17

申请号：DE69124411

申请日：1991-03-23

Applicant: IBM

Inventor： CUOMO JEROME J ,  GARZIOSO MICHAEL V ,  GUARNIERI CHARLES R ,  HALLER KURT L

IPC: H01L21/302 ,  C23C14/56 ,  C23C16/44 ,  C23C16/511 ,  C23F4/00 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065 ,  H01L21/683

公开(公告)号：DE69124411D1

公开(公告)日：1997-03-13

申请号：DE69124411

申请日：1991-03-23

Applicant: IBM

Inventor： CUOMO JEROME J ,  GARZIOSO MICHAEL V ,  GUARNIERI CHARLES R ,  HALLER KURT L

IPC: H01L21/302 ,  C23C14/56 ,  C23C16/44 ,  C23C16/511 ,  C23F4/00 ,  H01J37/32 ,  H01L21/205 ,  H01L21/3065 ,  H01L21/683

公开(公告)号：CA2024637A1

公开(公告)日：1991-04-24

申请号：CA2024637

申请日：1990-09-05

Applicant: IBM

Inventor： BENNETT REID S ,  ELLINGBOE ALBERT R ,  GIFFORD GEORGE G ,  HALLER KURT L ,  MCKILLOP JOHN S ,  SELWYN GARY S ,  SINGH JYOTHI

IPC: C23F4/00 ,  C23C16/44 ,  C23C16/515 ,  H01J37/32 ,  H01L21/302 ,  H01L21/461

Abstract: FI9-89-005 METHODS AND APPARATUS FOR CONTAMINATION CONTROL IN PLASMA PROCESSING Contamination levels in plasma processes are reduced during plasma processing, by prevention of formation of particles, by preventing entry of particles externally introduced or by removing particles spontaneously formed from chemical and/or mechanical sources. Some techniques for prevention of formation of particles include interruption of the plasma by pulsing the source of plasma energy periodically, or application of energy to provide mechanical agitation such as mechanical shockwaves, acoustic stress, ultrasonic stress, vibrational stress, thermal stress, and pressure stress. Following a period of applied stress, a tool is pumped out (if a plasma is used, the glow is first discontinued), vented, opened and flaked or particulate material is cleaned from the lower electrode and other surfaces. A burst of filtered air or nitrogen, or a vacuum cleaner is used for removal of deposition debris while the vented tool is open. Following this procedure, the tool is then be used for product runs. Alternatively, improvement of semiconductor process yields can be achieved by addition of reagents to getter chemical precursors of contamination particulates and by filtration of particulates from feedgas before plasma processing. The efficiency and endpoint for the applied stress are determined, by laser light scattering, using a pulsed or continuous laser source, e.g. a HeNe laser.